Faster And Better Floorplanning With ML-Based Macro Placement


The chips contained in today’s consumer and commercial electronic products are staggering in size and complexity. The largest devices include central processing units (CPUs), graphics processing units (GPUs), and system-on-chip (SoC) devices that integrate many functions on a single die. Additionally, chips are expanding beyond their traditional borders with multi-die approaches such as 2.5DI... » read more

Enabling The Next Generation Of Smarter Self-Navigating Robots Using Hybrid ToF Technology


Previous generations of robot vacuum cleaners have used a random pattern for cleaning that is inefficient and slow. Next-generation robots are much smarter and generate a map of the environment using sensors to localize themselves. This provides users with a floorplan of their home, from which the rooms and areas can be selected for cleaning or restricted from access. The new robots accomplish ... » read more

Ultimate Guide To Machine Learning For Embedded Systems


Machine learning is a subfield of artificial intelligence which gives computers an ability to learn from data in an iterative manner using different techniques. Our aim here being to learn and predict from data. This is a big diversion from other fields which poses the limitation of programming instructions instead of learning from them. Machine learning in embedded systems specifically target ... » read more

Navigating Design Challenges


Explore the future of IC design with the Calibre Shift left initiative. In this paper, author David Abercrombie reveals how Siemens is changing the game for block/chip design-stage verification by moving Calibre verification and reliability analysis solutions further left in the design flow, including directly inside your P&R tool cockpit. Discover how you can reduce traditional long-loop v... » read more

Everything You Need to Know About Wi-Fi 7


The IEEE 802.11be standard introduces several new features for improving WLAN efficiency, capacity, and coverage. Features such as multi-link operation (MLO) and multiple resource units (multi-RUs) increase the number of configurations and test scenarios to validate a device thoroughly. In addition to physical-layer testing, test engineers must emulate signaling to verify interactions between a... » read more

Leveraging Automotive Chip Design Techniques For Space-Borne Applications


Space-borne electronics must operate in an unforgiving environment with harsh conditions and little opportunity to repair failing components. A combination of functionally safe design, RHBD, and robust IP is required. Fortunately, automotive applications share many of the same challenges, and techniques to address these challenges are well established and proven. This white paper surveys the ma... » read more

Sea Of Processors Use Case


Core counts have been increasing steadily since IBM's debut of the Power 4 in 2001, eclipsing 100 CPU cores and over 1,000 for AI accelerators. While sea of processor architectures feature a stamp and repeat design, per-core workloads aren't always going to be symmetrically balanced. For example, a cloud provider (AI or compute) will rent out individual core clusters to customers for specialize... » read more

Cadence Cerebrus In SaaS And Imagination Technologies Case Study


Artificial Intelligence (AI) has made noteworthy progress and is now ready and available for electronic design automation. The Cadence Cerebrus Intelligent Chip Explorer utilizes AI—specifically, reinforcement machine learning (ML) technology—combined with the industry-leading Cadence digital full flow to deliver better power, performance, and area (PPA) more quickly. However, this highl... » read more

The Data Crisis Is Unfolding — Are We Ready?


The rapid advancement of technology has led to an unprecedented amount of data being generated, captured, and consumed globally. However, this reliance on data comes at a considerable cost. The widespread sharing and processing of data is necessary to navigate our everyday lives. Still, any disruption to this process can have severe consequences, threatening our ability to function as a society... » read more

How Multiphysics Simulation Enables 3D-IC Implementation At The Speed Of Light


Electronic designers need greater integration densities and faster data transfer rates to meet the increased performance requirements of technologies like 5G/6G, autonomous driving, and artificial intelligence. The semiconductor industry is shifting toward 3D-IC design to keep up with the ever-growing demand for high-performance and power-efficient devices that has outpaced the capabilities o... » read more

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