category: Whitepapers

category: IoT, Security & Automotive

Report: The Future of AI Processing
By Arm - 14 May, 2025 - Comments: 0

AI is now emerging in everyday use cases thanks to advances in foundational models, powerful chip technology, and abundant data. As a result, new approaches in AI compute are required to deploy these advanced use cases with minimal effort. This report features insights on how to move AI forward from industry leaders at AWS, Meta, Samsung and Arm, and includes research from MIT Technology Rev... » read more

Innovus+ Synthesis And Implementation System
By Cadence - 14 May, 2025 - Comments: 0

The Innovus+ platform incorporates Innovus synthesis and Innovus implementation capabilities, all integrated into one unified environment for outstanding ease of use and power, performance, and area (PPA) results. Innovus+ Synthesis can be used standalone to generate physically aware netlists ready for handoff to other design teams, such as ASIC partners, or the implementation flow can conti... » read more

E-Powertrain EMC Design And Validation
By Ansys - 14 May, 2025 - Comments: 0

In the pursuit of zero-emission vehicles, the design of the e-powertrain and its electronic systems encounters numerous challenges. From stringent regulatory requirements to the demand for enhanced performance and efficiency, the landscape is ripe with complexities. Here, simulation emerges as a vital tool, offering a pathway to navigate these challenges with precision and innovation. What y... » read more

Shifting Left With DFT To Optimize Productivity, Testability, And Time-To-Market
By Siemens EDA - 08 May, 2025 - Comments: 0

This paper discusses one of the Siemens EDA shift-left strategies in the RTL-to-signoff flow: shift-left design-for-test (DFT). Tessent RTL Pro software automates the analysis and insertion of Tessent VersaPoint test point technology, LBIST-OST test points, dedicated scan wrapper cells and x-bounding logic as behavioral code at the RTL level. Tessent RTL Pro builds on Tessent’s market-leading... » read more

Atomic Force Microscopy: The Definitive AFM Modes Handbook
By Bruker - 08 May, 2025 - Comments: 0

This handbook illustrates the wide variety of operating modes available on Bruker AFMs, going well beyond the standard high‑resolution topographic imaging capabilities of AFM. The modes are broken into seven separate categories: morphology, electromagnetic properties, thermal properties, mechanical properties, chemical properties, electrochemical properties, and manipulation. Each category be... » read more

Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap
By PDF Solutions - 08 May, 2025 - Comments: 0

Abstract: Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substr... » read more

Getting Real About AI Processors
By Imagination Technologies - 30 Apr, 2025 - Comments: 0

There’s a lot of confusion and hype around AI. Nearly every service, product or subject area in the technology industry now has an AI label. A lot of this is valid and there’s no doubt that AI is opening up new capabilities and higher productivity across all industries. This white paper categorises AI and related hardware options, with a particular focus on on-device (i.e. edge) AI, givi... » read more

Enhancing AI Datacenter PSUs With Hybrid-Si, SiC, And GaN Power Devices
By Infineon - 30 Apr, 2025 - Comments: 0

The rapid growth of artificial intelligence (AI) is driving an unprecedented demand for processing power in data centers, resulting in a surge in power demand at the rack level. With the existing data center rack sizes, the challenge is to deliver more power and efficiency in the same physical footprint apart from costs and cooling. To address this, Infineon has developed a range of hybrid powe... » read more

Flex PCBs Explained: From Materials to Applications Technical eBook
By Cadence - 30 Apr, 2025 - Comments: 0

This ebook provides a comprehensive overview of flex PCBs, highlighting their unique benefits, materials used, common challenges, and how you can overcome them. Learn about the various applications of rigid-flex/flex PCBs in modern electronics and gain insights into the future of flex design. Read more here. Fig.1: Small Flex PCB.  Source: Cadence. » read more

Multi-Die Design Start Guide
By Synopsys - 23 Apr, 2025 - Comments: 0

If you are exploring a multi-die project and need guidelines on getting started, this white paper is for you. Any engineer on a semiconductor design project has read many articles about the power, performance, and area (PPA), functional scalability, and time-to-market advantages of multi-die designs using 2.5D and 3D technologies. The advantages are the main reason the adoption of multi-die des... » read more

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