category: Whitepapers

category: IoT, Security & Automotive

Preparing For The Multiphysics Future Of 3D ICs
By Siemens EDA - 07 Nov, 2024 - Comments: 0

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

SONOS Non-Volatile Memory Technology
By Infineon - 07 Nov, 2024 - Comments: 0

The demand for embedded flash memory has grown steeply over the years as many new applications emerged in consumer electronics (touchscreens, smart cards, bank cards, mobile payment, e-passport, etc.) in addition to the industrial system-on-chip (SOC) designs. The memory content of these applications has been increasing steadily due to greater requirements on system performance and code/data st... » read more

Democratizing Roots of Trust from Silicon to Software
By Synopsys - 07 Nov, 2024 - Comments: 0

With a vast amount of devices getting connected to the Internet of Things (IoT) and the growing number of low-cost attacks being developed to hack such IoT devices, it is clear that the need for embedded security solutions is rising dramatically. A security subsystem in the main system-on-chip (SoC) of a device can be deployed to offer secure cryptographic services to the applications running o... » read more

Power Module Design for Electric Vehicles – Addressing Reliability and Safety
By Cadence - 07 Nov, 2024 - Comments: 0

This report presents an integrated approach to the efficient design of power modules used in electric vehicles and other high-power systems. The proposed flow enables the design of power modules for safety and reliability, co-optimizing die and package and obtaining power modules with reliable thermal performance at the design frequency and operating temperature. By incorporating a “shift lef... » read more

Accelerate AI SoC Designs with NoC Tiling
By Arteris - 30 Oct, 2024 - Comments: 0

Network-on-chip (NoC) tiling technology is revolutionizing AI and machine learning-enabled semiconductor designs. This emerging approach uses proven, robust network-on-chipIP to facilitate scaling, condense design time, speed testing and reduce design risk. It allowsSoC architects to create modular, scalable designs by replicating soft tiles across the chip. Each soft tile represents a self-con... » read more

Early Architecture Performance and Power Analysis of Multi-Die Designs
By Synopsys - 30 Oct, 2024 - Comments: 0

Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on those challenges that can be addressed by early architecture exploration of multi-die designs, including: -System pathfinding -Memory utilization and coherency -Power/thermal management Find out how to overcome such chall... » read more

Four Real-World Applications for Electromagnetic Simulation
By Keysight - 30 Oct, 2024 - Comments: 0

With the complexity of integrated circuit (IC) components increasing, electromagnetic (EM) circuit simulation is now critical for accurate and efficient design. The EM effects on a circuit can drastically alter voltage levels and damage semiconductor devices. With EM simulation, designers can account for EM effects on their circuit to avoid costly problems before they happen. EM simulation e... » read more

Unveiling the Stability of Proper Polyethyleneimine-Functionalized Carbon Nanotube Composites-Derived Chemiresistive CO2 Sensors
By Brewer Science - 24 Oct, 2024 - Comments: 0

A technical paper titled "Unveiling the Stability of Proper Polyethyleneimine-Functionalized Carbon Nanotube Composites-Derived Chemiresistive CO2 Sensors" was published by researchers at Brewer Science. Abstract "Branched polyethyleneimine (PEI), consisting of numerous imine groups, is employed for CO2 gas detection, attributed to the interaction between imine groups and CO2. Incorporatin... » read more

Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation
By Synopsys - 24 Oct, 2024 - Comments: 0

Disruptive AR systems will push the limits of optics: limits in design, limits in manufacturing, and limits in overall system integration. The trend of optical components being integrated into more complex miniaturized systems is impacting optical software. Optical design software has been around for decades to design, simulate, and analyze any optical component from lenses and mirrors to light... » read more

Overview Of The Current State of the Development Of Curvilinear Masks
By D2S - 24 Oct, 2024 - Comments: 0

A technical paper titled "Curvilinear masks overview: manufacturable mask shapes are more reliably manufacturable" was published by researchers at D2S. The paper covers: The rationale for curvilinear masks The application of the curvilinear inverse lithography technology The state of readiness of the curvilinear mask-making infrastructure, including mask rule checking, metrology, ... » read more

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