category: Whitepapers

category: IoT, Security & Automotive

Accelerating SI/PI Signoff: A Shift-Left Approach to PCB Design
By Cadence - 23 Apr, 2025 - Comments: 0

In high-speed PCB design, late-stage signal integrity (SI) and power integrity (PI) issues can lead to costly redesigns and delays. This white paper explores how in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring first-pass success. What You’ll Learn: The Shift-Left Advantage – How early SI/PI analysis minimizes late-s... » read more

Combination of Coherent and Non-Coherent NoCs Facilitates Cutting-Edge SoC Design
By Arteris - 23 Apr, 2025 - Comments: 0

SCALINX, a fabless semiconductor company specializing in the design of system-on-chip (SoC) devices, was looking to develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Business Challenge • Develop a large, next-generation SoC integrating analog, digital, mixed-signal, and RF functionality. Design Challenges • Ensure different portions ... » read more

Modeling Flux-Quantizing Josephson Junction Circuits
By Keysight - 23 Apr, 2025 - Comments: 0

We introduce Josephson junction and inductor models in Keysight ADS that feature an auxiliary flux port, and facilitate the expression of flux quantization conditions in simulation of superconducting microwave circuits. We present several examples that illustrate our methodology for constructing flux-quantizing circuits, including dc- and rf-SQUIDs, tunable couplers, and parametric amplifiers u... » read more

Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform
By ASE - 17 Apr, 2025 - Comments: 0

Abstract: "The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the high-bandwidth requirements of the Fan-Out Chip-on-Substrate (FOCoS) technology platform, additional layers are required. However, as the number of fanout layers increases, significant chall... » read more

Advanced Atomistic Simulation Techniques For Atomic Layer Etching
By Synopsys - 17 Apr, 2025 - Comments: 0

Continuous downscaling of the critical dimensions in semiconductor devices is the cornerstone of technological revolution. As the technology nodes keep shrinking, innovations in fabrication technologies are needed to continue the trend. We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrica... » read more

Arm AI Readiness Index
By Arm - 09 Apr, 2025 - Comments: 0

The Arm AI Readiness Index report is a comprehensive analysis of global AI readiness and implementation for enterprises worldwide. Drawing on survey data from business leaders across eight countries, the report offers a range of insights exploring the global opportunities and challenges around AI, including: Business adoption Technology requirement The policy and regulatory landscape... » read more

Discovering Digital Twins: A Complete Guide
By Ansys - 09 Apr, 2025 - Comments: 0

As artificial intelligence (AI) and machine learning (ML) continue to revolutionize industries, their integration with simulation is amplifying the capabilities of digital twins. AI/ML, simulation, and reduced-order modeling (ROM) technologies combine to create hybrid digital twins—virtual replicas that blend data-driven insights with the accuracy of physics-based models. This powerful approa... » read more

Is Liquid Cooling Right for Your Data Center: eBook
By Cadence - 09 Apr, 2025 - Comments: 0

As data centers face rising chip densities and energy costs, liquid cooling is emerging as a powerful solution. But is it the right fit for your facility? This eBook covers the essentials to help you decide. Who Should Read This eBook: -Senior management of data center operations -Data center designers and consultants -Engineers in IT and facilities management Key Takeaways: -Lear... » read more

Transforming The Semiconductor Industry: Future Roadmap For Generative AI On The Edge
By Expedera - 09 Apr, 2025 - Comments: 0

In the third of a three-part series, Expedera, in conjunction with the Global Semiconductor Alliance’s Emerging Technologies (EmTech) group explores “Transforming the Semiconductor Industry: Future Roadmap for Generative AI on the Edge”. This white paper explores key applications for Generative AI and the features they enable, as well as an examination of how model growth and differing mo... » read more

2025-Product Design Enhancement With Test Structures For Non-Contact Detection Of Yield Detractors
By PDF Solutions - 08 Apr, 2025 - Comments: 0

Abstract: Detection and monitoring of the yield loss mechanisms and defects in product chips have been a subject of extensive efforts, resulting in multiple useful Design-for-Manufacturing (DFM) and Design-for-Test (DFT) techniques. Defect inspection techniques extend optical inspection further into sub-10 nm nodes, but many buried defects are formed as a result of multi-layer 3-D interaction... » read more

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