category: Whitepapers

category: IoT, Security & Automotive

Silicon Lifecycle Management Platform
By Synopsys - 12 Oct, 2022 - Comments: 0

Silicon Lifecycle Management (SLM) is an emerging paradigm within the industry that is making product development and deployment more deterministic. In-silicon observability and insight are key when it comes to SLM and as an industry we can no longer afford to be blind to what is happening inside the chip. SLM is starting to close the loop between design and in-field. Click here to read more. » read more

Detection Of Electric Vehicles And Photovoltaic Systems In Smart Meter Data
By Fraunhofer IIS/EAS - 12 Oct, 2022 - Comments: 0

In the course of the switch to renewable energy sources, there is a shift from a few large energy sources (power plants) to a large number of small, distributed energy sources (e.g., photovoltaic systems) and energy storage devices (e.g., electric vehicles). This results in the need to know and identify these energy sources and sinks as soon as new devices are installed, in order to ensure grid... » read more

PLANAR: A Programmable Accelerator For Near-Memory Data Rearrangement
By Arm - 12 Oct, 2022 - Comments: 0

Many applications employ irregular and sparse memory accesses that cannot take advantage of existing cache hierarchies in high performance processors. To solve this problem, Data Layout Transformation (DLT) techniques rearrange sparse data into a dense representation, improving locality and cache utilization. However, prior proposals in this space fail to provide a design that (i) scales with m... » read more

Analysis Of Pattern Distortion By Panel Deformation And Addressing It By Using Extremely Large Exposure Field Fine-Resolution Lithography
By Onto Innovation - 11 Oct, 2022 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market. This includes smartphones, data centers, servers, high-performance computing (HPC), artificial intelligence (AI) and internet of things (IoT) applications. Next-generation packaging technologies require tighter overlay to accommodate larger package sizes with fine-pitch chip interconnects on large-format flexible panel... » read more

Quantification Of Steels And Alloys Using A Dual Source Multidetector System On SEM
By Bruker - 11 Oct, 2022 - Comments: 0

The accurate and precise analysis of steels and alloys is essential for understanding their mechanical and thermal properties. Such materials often have a wide range of elements at various concentrations down to trace ppm levels. Accordingly, it is not possible to determine the concentrations of all elements with a standard scanning electron microscope (SEM) and an energy dispersive spectromete... » read more

GUC GLink Test Chip Uses In-Chip Monitoring And Deep Data Analytics For High Bandwidth Die-To-Die Characterization
By proteanTecs - 11 Oct, 2022 - Comments: 0

Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized interconnect solution for both CoWoS and InFO packaging technologies. The GUC and proteanTecs collaboration started with GUC’s second generation of GLink, known as GLink 2.0. The project target was... » read more

The Development Of Front-End Module For 5G Millimeter-Wave Device Testing
By Advantest - 11 Oct, 2022 - Comments: 0

This article describes the development of a front-end module for 5G millimeter-wave device testing. 5G millimeter-wave is planned to be used up to the 53 GHz band. Our challenges are to optimize the performance of our test system up to that frequency band including wide power range of EVM performance, and to add a new one-port S-Parameter measurement function. We describe the elemental technolo... » read more

Similar But Different — The Tale Of Transient And Permanent Faults
By Siemens EDA - 05 Oct, 2022 - Comments: 0

When determining whether an IC is safe from random hardware faults, applying safety metrics such as PMHF, SPFM, and LFM, engineers must analyze both transient and permanent faults. This paper highlights the fundamental differences between permanent and transient faults on digital circuits, and why this distinction is important in the context of the ISO 26262:2018 functional safety standard. ... » read more

Ensuring Data Integrity And Performance Of High-Speed Data Transmission
By Cadence - 05 Oct, 2022 - Comments: 0

In key electronics applications such as data centers, automotive, and 5G, the data speed and volume are increasing at an exponential rate. Data centers require data transmission (Figure 1) as high as 112Gbps, which can be achieved only using PAM4 signaling. The automotive industry is dealing with the challenges of transferring data between various electronic control units (ECUs) at a very high ... » read more

Capture Effective Hardware Security Requirements In 3 Steps
By Cycuity (Formerly Tortuga Logic) - 05 Oct, 2022 - Comments: 0

As hardware vulnerabilities continue to rise, it’s increasingly crucial for those developing semiconductors to reduce consumer and business risk by establishing comprehensive security programs. These should include a systematic process for developing security requirements, verifying them at scale throughout the design process, and producing final documentation for security sign-off before tap... » read more

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