Reducing Security Vulnerabilities In Connected Cars And Factories With Secured Flash


Analysts estimate that more than half of all cars sold in the U.S. this year will come with internet connectivity(1), and Gartner believes more than 750,000 cars with autonomous driving capabilities will roll off manufacturing lines by 2023(2). As more vehicles become connected and go autonomous, the possibility of bad actors taking control of cars on the road is very real, and likely to become... » read more

First Line of Defense: Developer Security Tools In The IDE


We all want to produce better and more secure software, and we want to do it faster than ever before. For developers, this means taking on more responsibility for security without sacrificing velocity, as well as learning new tools and processes that may have been prescribed by teams that are disconnected from the development process. By bringing security detection and remediation into the i... » read more

Rambus RT-640 Road To ISO26262 Certification


Modern vehicles incorporate an increasing number of complex integrated circuits. Failures in automotive systems can lead to damage to property, injury or loss of life. Ensuring the reliability of electronic systems is crucial, and the ISO26262 standard documents the requirements for determining automotive functional safety. This whitepaper details the process for how Rambus achieved t... » read more

Interactive Symmetry Checking Provides Faster, Easier Symmetry Verification For Analog And Custom IC Designs


Device symmetry ensures accurate, efficient performance of analog and custom IC designs. However, traditional physical verification for symmetry is complex and time-consuming. Calibre interactive symmetry checking runs inside the design environment to simplify and enhance IC symmetry verification. Design teams can use Calibre interactive symmetry checking to quickly and accurately analyze layou... » read more

Efficient Verification Of Mixed-Signal Series IP Using UVM


Interface IP are an integral part of systems-on-chips (SoC) that include mobile, automotive, or networking applications and are primarily used for transmitting data over a physical medium between a host and device. The mixed-signal nature of the IP makes verification a challenging task, requiring special considerations for digital and analog sections. This paper describes a robust mixed-signal ... » read more

Faster & Smarter LVS For The SoC Era


Development of a modern system-on-chip (SoC) device is a long and incredibly complex process. Design teams rely on a huge range of tools, technologies, and methodologies to get the job done. Given the ongoing advances in silicon technology and design architecture, the tools are in a constant state of evolution. Logic-versus-schematic (LVS) checking is one of those tools. This is one of the earl... » read more

DDR Memory Test Challenges From DDR3 to DDR5


Cloud, networking, enterprise, high-performance computing, big data, and artificial intelligence are propelling the development of double data rate (DDR) memory chip technology. Demand for lower power requirements, higher density for more memory storage, and faster transfer speeds are constant. Servers drive the demand for next-generation DDR. Consumers benefit when existing and legacy generati... » read more

64-Bit RISC-V Microprocessor Delivers New Options For IoT Edge Development


Global and rapidly expanding IoT edge devices are becoming increasingly important for connecting various sensors to the cloud via networks. IoT edge devices are progressively integrating 64-bit microprocessors capable of running Linux and similar high-performance operating systems. Moreover, recent import and export regulation changes have produced a need for choices in CPU architecture for mic... » read more

A Study Of The Impact Of Line Edge Roughness On Metal Line Resistance Using Virtual Fabrication


BEOL metal line RC delay has become a dominant factor limiting chip operation speeds at advanced nodes. This is because smaller metal line pitches require narrower line CD and line-to-line spacing, which introduces higher metal line resistance and line-to-line capacitance. A surface scattering effect is the root cause for the exponentially increased metal resistivity at smaller metal line pitch... » read more

Services Beyond Packaging, Summer 2022 Newsletter


Technology Focus: Services Services Beyond Packaging: QP Technologies is known for offering a wide range of package types. We also provide a variety of semiconductor manufacturing services to meet your packaging and assembly requirements. These include wafer preparation (backgrinding, dicing, die sort and inspection), IC assembly processes for a variety of package types and materials, laser ... » read more

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