Intel and Cadence Collaboration on UCIe: Demonstration of Simulation Interoperability


The Universal Chiplet Interconnect Express (UCIe) 1.0 specification was announced in early 2022. A new updated UCIe 1.1 specification was released on August 8, 2023. The standardized open chiplet standard allows for heterogeneous integration of die-to-die link interconnects within the same package. The UCIe standard allows for advanced package and standard package options to tradeoff cost, band... » read more

A Software-First Mindset for Driving Efficiency and Sustainability for Industrial IoT


Schneider Electric, Arm, and system integrators Witekio and Capgemini have produced a software-defined platform for industrial automation and energy management. The platform uses cloud-native techniques to create a flexible, energy-efficient reference design that uses virtualization to enable real-time, mixed-criticality services at the embedded edge. Read more here. » read more

Joint Interdisciplinary Work To Enable Novel, Industry-Ready Chiplet Solutions


Fraunhofer is going to establish the Chiplet Center of Excellence (CCoE), which is a unique research activity based on Fraunhofer‘s long experience and broad research portfolio in design, implementation and test of 2.5 and 3D integrated electronic systems. The Center aims at establishing a common understanding among the partners and at creating a suitable chiplet development methodology. This... » read more

Decoding Glitch Power at the RTL Stage


In the context of analyzing digital semiconductor circuits, a glitch is any unwanted or unused signal transition, or toggle. A glitch is often a transient signal that is much shorter than a clock period and therefore is not captured by the next register stage. We also encounter full transition glitches, or transport glitches, which refer to toggles in a data path circuit that cover a full clock... » read more

Controller Area Network (CAN) Overview


What is CAN? A controller area network (CAN) bus is a high-integrity serial bus system for networking intelligent devices. CAN busses and devices are common components in automotive and industrial systems. Using a CAN interface device, you can write LabVIEW applications to communicate with a CAN network. CAN History Bosch originally developed CAN in 1985 for in-vehicle networks.... » read more

Expediting Manufacturing Safe Launch With Big Data AI/ML Analytic Solutions On The Cloud


With highly competitive time-to-market and time-to-volume windows, IC suppliers need to be able to release new product to production (NPI) in a timely manner with competitive manufacturing metrics. Manufacturing yield, test time and quality are important metrics in NPI to Manufacturing safe launch. A powerful yield management system is crucial to achieve the goal metrics. In this paper, recomme... » read more

Understanding the Importance of Power System Reliability Modelings


Given the unique challenges that power supplies in high-reliability environments face, Infineon decided to investigate Power System Reliability Modeling (PSRM) and develop innovative solutions to overcome those challenges. This whitepaper will serve as an introduction to this topic and pave the way into this new and innovative field. Read more here. » read more

Requirements and Best Practices for Trustworthy Automotive Semiconductors


The complexity of electronic systems supporting Advanced Driver Assistance Systems (ADAS), Highly Automated Driving (HAD), and in-vehicle infotainment is growing exponentially. This, together with the move from multiple domain-specific Electronic Control Units (ECUs) to a zonal architecture will require high-performance computing. Furthermore, new use cases for Battery Electric Vehicles (BEV) i... » read more

Simplifying AI Deployment from the Cloud to Edge and Endpoint


Artificial Intelligence (AI) is transforming every aspect of life. It is enhancing quality in industrial applications, enabling smart home systems, monitoring our safety as we work and play. Advances in technology have allowed us to run complex machine learning algorithms to tackle unique problems allowing those to be implemented also on embedded devices used in our daily life in home and indus... » read more

Aeroacoustics Large-Eddy Simulation of VTOL Aircraft Design


This conference paper, co-authored by Honda Motor Co. and Cadence, reveals  findings on the aeroacoustics predictions of multibladed vertical take-off and landing (VTOL) rotors using large-eddy simulations (LES). Why should you read this white paper? Advanced Simulations: We conducted simulations on VTOL rotors with two to five blades, assessing high-frequency noise predictions. Exp... » read more

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