category: Whitepapers

category: IoT, Security & Automotive

High Thermal Die-Attach Paste Development For Analog Devices
By Amkor - 20 Oct, 2021 - Comments: 0

Authors: Kiichiro Higaki, Toru Takahashi, Akinori Ono from Assembly Engineering Department Amkor Technology Japan, Inc. Keiichi Kusaka, Takayuki Nishi, Takeshi Mori from Information & Telecommunication Materials Research Laboratory, Sumitomo Bakelite Company, Limited Daisuke Koike, Masahiko Hori from Package Solution Technology Development Department, Electronic Devices & Storage Res... » read more

Bringing Intelligent Headlamps To Light via Simulation
By Ansys - 13 Oct, 2021 - Comments: 0

Once seen as a basic, utilitarian product feature, today automotive headlamps are becoming much more innovative — and a critical source of competitive differentiation. Intelligent headlamps, which autonomously produce adaptive light beams, are capturing the imagination of the world’s automakers and consumers alike. But how can automotive engineering teams verify the performance of their com... » read more

Introducing mPower
By Siemens EDA - 13 Oct, 2021 - Comments: 0

Power integrity analysis evaluates circuits to determine if they will provide their designed/intended performance and reliability as implemented. Designers must be able to verify analog and digital power integrity from the RTL/gate-level through die-level integrations up to the package and board system-level. The mPower toolset is an innovative power integrity verification solution that brings ... » read more

How Semiconductor Solutions Address Safety Requirements Of Future Power Distribution Networks In Autonomous Vehicles
By Infineon - 13 Oct, 2021 - Comments: 0

Open up the bonnet of any modern automobile and many of us would be hard-pressed to find anything that we could fix ourselves. With pipes and cables almost artistically integrated into the engine bay, and sleek plastic covers fitted everywhere, there is very little that can still be recognized, yet alone repaired. Perhaps the only location where we feel comfortable is the “fuse box”, or pow... » read more

Execution Dependence Extension (EDE): ISA Support For Eliminating Fences
By Various Writers - 13 Oct, 2021 - Comments: 0

Fence instructions are a coarse-grained mechanism to enforce the order of instruction execution in an out-of-order pipeline. They are an overkill for cases when only one instruction must wait for the completion of one other instruction. For example, this is the case when performing undo logging in Non-Volatile Memory (NVM) systems: while the update of a variable needs to wait until the correspo... » read more

Manage Scaling Challenges For Silicon Success
By Siemens EDA - 12 Oct, 2021 - Comments: 0

Semiconductor companies are faced with significant challenges related to technology scaling, design scaling, and system scaling. These challenges have a broad impact on design development, manufacturing, and functional operation. This paper discusses the challenges and the specific impact of a Silicon Lifecycle Solutions approach that includes DFT, operations, and Embedded Analytics in enabling... » read more

Advanced Outlier Die Control Technology In Fan-Out Panel Level Packaging Using Feedforward Lithography
By Onto Innovation - 12 Oct, 2021 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Fan-out panel level packaging (FOPLP) is one of the technologies that... » read more

High-Speed Image Processing By GPU
By Advantest - 12 Oct, 2021 - Comments: 0

By using CPU and GPU together, we have increased the speed of the filter function that is often used in imaging tests. This feature is provided by the Image Processing Library (IPL) in T2000 CMOS Image Sensor Solution. Next IPE, our new image processing engine that is currently in development, is about six times faster than IPE3 (Image Processing Engine 3), an existing engine. Author: Chiezo... » read more

Accelerating Verification Shift Left With Intelligent Coverage Optimization
By Synopsys - 12 Oct, 2021 - Comments: 0

Functional verification dominates semiconductor development, consuming the largest percentage of project time and resources. Team members look at the rate of design bug discovery, consider anecdotal information on the types of bugs that escaped to silicon in previous projects, and use their best judgment based on their years of experience to determine when to tape out. Above all, they look at v... » read more

Adaptive Computing In Robotics
By Xilinx - 08 Oct, 2021 - Comments: 0

Traditional software development in robotics is about programming functionality in the CPU of a given robot with a pre-defined architecture and constraints. With adaptive computing, instead, building a robotic behavior is about programming an architecture. By leveraging adaptive computing, roboticists can adapt one or more of the properties of its computing systems (e.g., its determinism, power... » read more

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