category: Whitepapers

category: IoT, Security & Automotive

Holistic FMEDA-Driven Safety Design And Verification For Analog, Digital, And Mixed-Signal Design
By Cadence - 21 Dec, 2021 - Comments: 0

With state-of-the-art electronics propelling the automotive industry into the future, automotive OEMs require safety-certified semiconductors. The integration of these advanced technologies into cars drives a need for component suppliers to assess and audit the risk of the technologies they want to deploy. At the same time, safety requirements are constantly evolving and becoming more stringent... » read more

Flexible USB4-Based Interface IP Solution For AI At The Edge
By Synopsys - 21 Dec, 2021 - Comments: 0

Consumers have become accustomed to smart devices that are powered by advances in artificial intelligence (AI). To expand the devices’ total addressable market, innovative device designers build edge AI accelerators and edge AI SoCs that support multiple use cases and integration options. This white paper describes a flexible USB4-based IP solution for edge AI accelerators and SoCs. The IP so... » read more

A Novel Multifunctional Single-Layer Adhesive Used For Both Temporary Bonding And Mechanical Debonding in Wafer-Level Packaging Applications
By Brewer Science - 15 Dec, 2021 - Comments: 0

Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out integration, and 2.5D and 3D integration using through-silicon vias (TSVs). The materials used to achieve TB and DB are extremely critical and the industry's current best practice is the use of tw... » read more

The Physics Of Ports And Associated Ground For EM Simulators Serving RF Designs
By Cadence - 09 Dec, 2021 - Comments: 0

The use of ports in electromagnetic (EM) simulators has evolved and matured over the years to make real-world design simulations practical. Having a foundational understanding of ports provides an intuitive skill in their proper selection and use in conjunction with circuit simulation. In this white paper, we examine ports common to EM simulators, which are the most common simulators for microw... » read more

How Safety Requirements For Autonomous Vehicles Will Reinvent Fuse And Relay Boxes In Automotive Power Distribution
By Infineon - 09 Dec, 2021 - Comments: 0

Open up the bonnet of any modern automobile and many of us would be hard-pressed to find anything that we could fix ourselves. With pipes and cables almost artistically integrated into the engine bay, and sleek plastic covers fitted everywhere, there is very little that can still be recognized, yet alone repaired. Perhaps the only location where we feel comfortable is the “fuse box”, or pow... » read more

Veloce Prototyping Solutions Accelerate Verification Of HPC AI-Enabled SoCs
By Siemens EDA - 08 Dec, 2021 - Comments: 0

This white paper goes through the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design. The starting point in the journey explores the use cases for designs illustrating the impact HPC AI-enabled systems and resources have on o... » read more

Simulation Workflow For Efficiency Calculation Of A High-Performance Electric Powertrain
By Ansys - 08 Dec, 2021 - Comments: 0

In battery electric vehicles the efficiency of the powertrain has a big impact on driving range and performance. As the overall efficiency of the electric powertrain is typically more than 90%, further optimization is challenging. Especially in high-performance electric vehicles, the efficiency over one or multiple laps on a racing track is crucial. It requires accurate estimation of power loss... » read more

Design Meets EDA: Gaps And Countermeasures In Analog/Mixed-Signal IC Design
By Fraunhofer IIS/EAS - 08 Dec, 2021 - Comments: 0

Along the path from specification to silicon, the design of analog/mixed-signal chips comprises a variety of challenges. They are of technological, methodological, organizational, communicational, and business nature. Additionally, large gaps are to be managed among the individual challenges. Still up to now, approaches such as the “four eye principle” are used even in industrial practice i... » read more

Arm Neoverse N1 Core: Performance Analysis Methodology
By Arm - 08 Dec, 2021 - Comments: 0

The Arm Neoverse ecosystem is growing substantially with many Arm hardware and software partners developing applications and porting their workloads onto Arm-based cloud instances. With Neoverse N1 based systems becoming widely available, many real-world workloads are showing very competitive performance and significant cost savings when compared to legacy systems. Some recent examples include:... » read more

Scaling Processor Performance And Safety To Meet Requirements For Next-Generation Safety-Critical Automotive Designs
By Synopsys - 08 Dec, 2021 - Comments: 0

This white paper proposes a state-of-the-art processor architecture targeting automotive safety systems that meets the requirements of such active safety systems delivering the required processing performance, providing the highest automotive safety integrity level (ASIL) while also significantly contributing to a reduction in overall cost of the systems through the use of artificial neural net... » read more

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