category: Whitepapers

category: IoT, Security & Automotive

System-Level Benefits Of The Versal Platform
By Xilinx - 01 Sep, 2021 - Comments: 0

Moore's Law has fueled the technological prosperity of the last 50 years, but it is generally believed now that Gordon Moore's 1965 forecast about the pace of innovation no longer holds true today. Continuing the silicon architectures of yesterday cannot meet the expanding demands of tomorrow's workloads. Frequently highlighted by today’s leaders in the field of computer architecture, to meet... » read more

Connecting Teams With A Collaboration Hub In The Cloud
By Siemens EDA - 25 Aug, 2021 - Comments: 0

Given the complexities inherent in both next-generation products and the underlying components used, effective collaboration is fundamental to successfully navigating the product creation journey. Teams that are better synchronized and aligned are far more likely to deliver a successful product to market on time and on budget. Explore how the Connect application extends the power of PADS Pro... » read more

RTL Architect: Parallel RTL Exploration With Unparalleled Accuracy
By Synopsys - 25 Aug, 2021 - Comments: 0

Increasing chip complexity and restrictive advanced node rules have made it harder for implementation tools to achieve PPA targets and node entitlements via last-mile optimizations. RTL Architect enables designers to "shift-left" and predict the implementation impact of their RTL. RTL designers, SoC integrators, and IP developers have embraced this fast, predictive technology to give them new i... » read more

800G Ethernet MACsec Integration And Verification
By Cadence - 25 Aug, 2021 - Comments: 0

Ethernet is the interconnect technology of choice for a wide range of applications including (but not limited to) data centers, wireless backhaul, automotive, artificial intelligence (AI), and many other use cases. It is ubiquitous. As bandwidth requirements continue to scale to ever-dizzying heights due to the proliferation of data-intensive applications, developing, integrating, and validatin... » read more

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach
By Brewer Science - 19 Aug, 2021 - Comments: 0

One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents variations from the via arrays to the open areas, which cause the variation of CDs: the swing effect. The planarization of a DD via-first process is reported. A dual-layer solution is used to demonst... » read more

Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS
By Amkor - 18 Aug, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging [1]. Wafer-level fanou... » read more

Process Variation Analysis Of Device Performance Using Virtual Fabrication — Methodology Demonstrated On A CMOS 14-nm FinFET Vehicle
By Coventor - 18 Aug, 2021 - Comments: 0

A new methodology is demonstrated to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. A model of a FinFET device was built using virtual device fabrication and testing. The model was subsequently calibrated on Design of Experiment corner case data that had been collected on a limited number of processed fab wafers. W... » read more

Servers And The Drive To DDR5
By Rambus - 13 Aug, 2021 - Comments: 0

This IDC Technology Spotlight Study, sponsored by Rambus, discusses server demands on DRAM and different workloads. DRAM must dynamically adjust to the needs of these disparate workloads. The history of dynamic random-access memory (DRAM) is characterized by the ability of the technology to adapt to the increasingly specialized real-time memory requirements of the applications that utilize it. ... » read more

Condition Monitoring Of Drive Trains By Data Fusion Of Acoustic Emission And Vibration Sensors
By Fraunhofer IIS/EAS - 13 Aug, 2021 - Comments: 0

Early damage detection and classification by condition monitoring systems is crucial to enable predictive maintenance of manufacturing systems and industrial facilities. The data analysis can be improved by applying machine learning algorithms and fusion of data from heterogenous sensors. This paper presents an approach for a step-wise integration of classifications gained from vibration and ac... » read more

Physics-Based Sensor Validation Via Ansys: Driving New Automotive Innovations
By Ansys - 13 Aug, 2021 - Comments: 0

Autonomous driving is revolutionizing the global automotive industry. With every new model, cars are smarter and more capable of independently responding to external signals like lane markings, highway signs, other cars and pedestrians. However, formulating a correct response via artificial intelligence depends on flawless sensor performance. With so many sensors supporting the advanced driv... » read more

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