category: Whitepapers

category: IoT, Security & Automotive

Underlayer Optimization Method For EUV Lithography
By Brewer Science - 21 Jul, 2021 - Comments: 0

Photoresist and underlayer combine to serve a central role in EUVL for patterning. Layers will be very thin in future, because high numerical aperture (NA) and tight pitches will require very thin layers in the lithography stack. This thinness will make chemical interactions at the photoresist-underlayer interface more common. Adhesion between these layers will be critical to overcome pattern c... » read more

Survey: 2020 eBeam Initiative Annual Survey Results
By eBeam Initiative - 21 Jul, 2021 - Comments: 0

Aki Fujimura, the CEO of D2S, Inc. presented "The eBeam Initiative's Annual Survey Results at Photomask" at Photomask Japan 2021 in April 2021. Survey says that COVID has a net neutral business impact on total mask revenues. By 2021, 24% positive vs 20% negative COVID-related business predictions. 74% agree actinic inspection for EUV HVM by 2023, and more results. Click here to read more. » read more

Will An Adhesion Promoter Prevent Delamination In Power Semiconductor Packages?
By Amkor - 21 Jul, 2021 - Comments: 0

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is essential. As more semiconductor pack... » read more

Innovative Dual Mark Design For Alignment Verification And Process Monitoring In Advanced Lithography
By UMC - 21 Jul, 2021 - Comments: 0

Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, it is possible to determine intra-wafer distortion wafer-by-wafer. Both the measurement and modeled results are applied directly as a feed-forward correction to enable wafer level control. In this p... » read more

The Effects Of Poly Corner Etch Residue On Advanced FinFET Device Performance
By Coventor - 21 Jul, 2021 - Comments: 0

In this paper, we study the effect of poly corner residue during a 5nm FinFET poly etch process using virtual fabrication. A systemic investigation was performed to understand the impact of poly corner residue on hard failure modes and device performance. Our results indicate that larger width and height residues can lead to a hard failure by creating a short between the source/drain epitaxy an... » read more

Streaming Scan Network
By Siemens EDA - 12 Jul, 2021 - Comments: 0

The traditional approach to moving scan test data from chip-level pins to core-level scan channels is under pressure due to the dramatic rise in design size, design complexity, and test adaptation. In the traditional approach to delivering scan test data to cores, each core requires a dedicated connection to chip-level pins, which doesn’t allow for much flexibility, as the dependencies betwee... » read more

Gate Drive Solutions For CoolGaN 600 V HEMTs
By Infineon - 08 Jul, 2021 - Comments: 0

This paper explains the gate drive requirements for Infineon’s CoolGaN 600 V e-mode HEMTs. Various driving solutions are discussed, ranging from the standard RC-coupled driver to a new differential drive concept utilizing dedicated gate driver ICs. In half-bridge topologies, a hybrid configuration combining isolated and non-isolated drivers could be an exciting alternative. Practical applicat... » read more

AiP/AiM Design For mmWave Applications — Advanced RF Front-End Design Flows From Concept To Signoff
By Cadence - 08 Jul, 2021 - Comments: 0

System requirements for broad bandwidth, millimeter-wave (mmWave) spectrum, phased arrays, and integrated antennas and front-ends are evolving. The challenge for engineers will be achieving the cost, size, and performance requirements that will make these products commercially viable. All these factors align to drive next-generation component integration, which includes embedding the antenna wi... » read more

Bringing Reset And Power Domains Together
By Siemens EDA - 07 Jul, 2021 - Comments: 0

The Unified Power format (UPF) standard enables designers to add power intent for a design. For power management, designers typically partition a design into power domains. Interactions between these power domains are done through various power control logic, like retention logic, isolation logic, and level shifters. Designers need to validate that the power control logic does not introduce new... » read more

MIPI Drives Performance For Next-Generation Displays
By Rambus - 07 Jul, 2021 - Comments: 0

MIPI Alliance technology has helped enable the dramatic growth of the mobile phone market. The function and capabilities of MIPI interface solutions have grown dramatically as well. MIPI DSI-2 has become the leading display interface across a growing range of products including smartphones, AR/VR, IoT appliances, and ADAS/autonomous vehicles. As the application space has expanded, so too have t... » read more

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