category: Whitepapers

category: IoT, Security & Automotive

MIPI Drives Performance for Next-Generation Displays
By Mixel - 12 May, 2021 - Comments: 0

In late 2000, Nokia announced its iconic 3310 handset which featured an 84×48-pixel pure monochrome display. Seven years later, Apple unveiled its first iPhone with a 90mm (3.5”) screen and 320×480-pixel resolution (at 163 ppi). Cameras and high-quality displays quickly became the de-facto standard for smartphones by the mid-2000s. However, proprietary interface solutions for connecting cam... » read more

Recommendations And Solutions For USB-C PD Chargers
By Infineon - 12 May, 2021 - Comments: 0

The recent enhancements and technology advancements in the charger domain have made engineers face new challenges in their daily lives. Higher efficiency, smaller footprint with the same output power, or more power in the same footprint are among the key challenges in contemporary charger designs. In this whitepaper, Infineon provides engineers with an overview of different solutions in the USB... » read more

Study On High-Performance Computing Usage For Engineering Simulation
By Ansys - 12 May, 2021 - Comments: 0

Simulation will play a critical role in the development of new market disrupting technology, from autonomous vehicles to 5G cellular networks, and the need for on-premises or cloud-based HPC resources to support those efforts is only going to increase. This white paper explores: How companies are using HPC-based simulation. The effect of the COVID-19 pandemic on HPC usage and adoptio... » read more

Acoustic Metrology for Fine Pitch Microbumps in 3D IC
By Onto Innovation - 11 May, 2021 - Comments: 0

The continuing shift to 3D integration requires formation of electrical interconnects between multiple vertically stacked Si devices to enable high speed, high bandwidth connections. Microbumps and through silicon vias (TSVs) enable the high-density interconnects for die-to-die and die-to-wafer stacking for different applications. In this paper, we present acoustic metrology techniques for the ... » read more

FPGA Prototyping: Supersizing Scale And Performance
By Synopsys - 11 May, 2021 - Comments: 0

Given the cost of re-spinning a system-on-chip (SoC), semiconductor companies have always looked for ways to verify and validate the SoC before tape-out. Prototyping using field programmable gate arrays (FPGAs) became a key methodology as part of this pre-silicon verification and validation effort. Click here to read more. » read more

A Novel Memory Test System With An Electromagnet For STT-MRAM Testing
By Advantest - 11 May, 2021 - Comments: 0

We have successfully developed, for the first time, a new memory test system for STT-MRAM at wafer-level where an electromagnet is combined with a memory test system and a 300 mm wafer prober. In the developed memory test system, an out-of-plane magnetic field up to ±800 mT can be applied on 10 x 10 mm2 in the 300 mm wafer with distribution of less than 2.5%. We demonstrated that the electroma... » read more

Monitor And Control Automotive Devices With Over-The-Air Updates
By Siemens EDA - 05 May, 2021 - Comments: 0

Modern vehicles are complex electronic devices that require regular over-the-air (OTA) system and software updates to ensure their correct and safe operation. This paper discusses the need for OTA and the Siemens solutions that ensure OTA updates are secure and meet all regulations and standards. To read more, click here. » read more

MACsec Explained: Securing Data in Motion
By Rambus - 05 May, 2021 - Comments: 0

For end-to-end security of data, it needs to be secured when at rest (processed or stored in a device) and when in motion (communicated between connected devices). For data at rest, a hardware root of trust anchored in silicon provides the foundation upon which all data security is built. Similarly, for data in motion, security anchored in hardware at the foundational communication layer prov... » read more

Penetration Testing: A Buyer’s Guide
By Synopsys - 05 May, 2021 - Comments: 0

Data breaches continue to plague organizations—whether they’re targeted attacks from outside or malicious insiders. According to the 2020 IBM “Cost of Data Breach” report, 52% of breaches were caused by a malicious attack and the average total cost of a breach was $3.86 million. Many of these breaches are the result of combinations of errors or vulnerabilities, with attackers working th... » read more

Enabling The Next Step In IC Test And Monitoring
By Siemens EDA - 21 Apr, 2021 - Comments: 0

Product lifecycle management (PLM) is a well-established concept across many industries that aims to manage the entire lifecycle of a product from inception through design, realization, deployment, and field service, right through to end-of-life activities such as final disposal. More recently, these principles are being applied by the semiconductor industry because electronics continue to p... » read more

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