Chiplet and interposer verification; SNN hardware attack; multi-chip-module communication; self-heating effects on FeFETs for IMC; GPU inferencing; ESD event detection; wireless cyberattacks on vehicles; inter-chiplet interconnect topology.
New technical papers recently added to Semiconductor Engineering’s library:
| Name of Paper | Research Organizations |
|---|---|
| ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification | Worcester Polytechnic Institute |
| Input-Triggered Hardware Trojan Attack on Spiking Neural Networks | Sorbonne Universite, CNRS and Queen’s University Belfast |
| MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules | Georgia Tech |
| Investigating Self-Heating Effects in Ferroelectric FinFETs for Reliable In-Memory Computing | TU Munich, University of Stuttgart and Indian Institute of Technology, Kanpur |
| Scaling On-Device GPU Inference for Large Generative Models | Google and Meta Platforms |
| Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection | National Yang Ming Chiao Tung University |
| Revisiting Wireless Cyberattacks on Vehicles | Comillas Pontifical University and MIT |
| FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates | ETH Zurich |
Find more semiconductor research papers here.
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