GPU energy; chiplets thermal modeling; ferroelectric thin-film transistors; BEOL-compatible 3D logic; fingerprinting advanced IC packages; signal processing for radar; review of image sensors and photodetectors; semiconductor-free logic gates.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures | University of Wisconsin–Madison, Washington State University, and University of Ulsan |
| Online Energy Optimization in GPUs: A Multi-Armed Bandit Approach | Illinois Institute of Technology, Argonne National Lab and Emory University |
| An efficient device model for ferroelectric thin-film transistors | University of Florida |
| Omni 3D: BEOL-Compatible 3D Logic with Omnipresent Power, Signal, and Clock | Stanford University, Intel Corporation, and Carnegie Mellon University |
| Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging | University of Florida and University of Cincinnati |
| Signal processing architecture for a trustworthy 77GHz MIMO Radar | Fraunhofer FHR, Ruhr University Bochum, and Wavesense Dresden GmbH |
| Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed Semiconductors | Cardiff University |
| Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses | MIT |
More Reading
Chip Industry Week In Review
AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more.
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