Empower AI hardware designers with big data analytics, elastic compute scalability and multiphysics simulations to meet the challenges at advanced nodes across chip, package and systems.
Achieving power efficiency, power integrity, signal integrity, thermal integrity and reliability is paramount for enabling product success by overcoming the challenges of size and complexity in AI hardware and optimizing the same for rapidly evolving AI software. ANSYS’ comprehensive chip, package and system solutions empower AI hardware designers by breaking down design margins and siloed design methodologies with multiphysics simulations and multi variable analytics to exceed PPA and reliability goals. ANSYS brings together the power of big data analytics, elastic compute scalability and multiphysics simulations to simultaneously address power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first time silicon to system success.
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