Moving Data And Computing Closer Together


The speed of processors has increased to the point where they often are no longer the performance bottleneck for many systems. It's now about data access. Moving data around costs both time and power, and developers are looking for ways to reduce the distances that data has to move. That means bringing data and memory nearer to each other. “Hard drives didn't have enough data flow to cr... » read more

Power Impact At The Physical Layer Causes Downstream Effects


Data movement is rapidly emerging as one of the top design challenges, and it is being complicated by new chip architectures and physical effects caused by increasing density at advanced nodes and in multi-chip systems. Until the introduction of the latest revs of high-bandwidth memory, as well as GDDR6, memory was considered the next big bottleneck. But other compute bottlenecks have been e... » read more

Blog Review: July 8


Cadence's Paul McLellan profiles Alessandra Nardi, recipient of this year's Marie R. Pistilli Women in EDA award, how she entered the industry and her latest work on automotive and a functional safety language. In a video, Mentor's Colin Walls checks out why RISC-V is the hot new fashion in embedded systems development. A Synopsys writer explains why the MACsec security protocol is so imp... » read more

Shift Left Verification With Comprehensive Lint Signoff


With soaring complexity and continuously increasing chip sizes, achieving efficient and predictable design closure has become a prominent challenge among designers today. Demand for a faster time to market is forcing designers to find ways to shorten design cycles with accurate, efficient, one-time RTL to silicon. To meet these requirements designers are looking to implement early ”shift left... » read more

Advanced Packaging Makes Testing More Complex


The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Monitoring IC Abnormalities Before Failures


The rising complexities of semiconductor processes and design are driving an increasing use of on-chip monitors to support data analytics from an IC’s birth through its end of life — no matter how long that projected lifespan. Engineers have long used on-chip circuitry to assist with manufacturing test, silicon debug and failure analysis. Providing visibility and controllability of inter... » read more

Chip Reliability Vs. Cost


Semiconductor Engineering sat down to discuss the cost, reliability and security with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. What follows are excerpts of that virtual conversation... » read more

Week In Review: Design, Low Power


Galaxy Semiconductor re-established with the planned acquisition of the Quantix Business assets from Mentor, a Siemens business. The software products Galaxy is acquiring focus on yield optimization, device characterization, and reliability improvement. Galaxy was initially founded in 1998; the Galway, Ireland-based company was then acquired by Mentor Graphics in 2016. The re-established compan... » read more

Week In Review: Auto, Security, Pervasive Computing


The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Automotive Gateway IP Enabling Scalable Automotive Platforms


As automakers introduce new electronic platforms, the system architectures are changing from distributed ECUs to integrated domain compute modules. This evolution, along with the increased number and types of sensors for ADAS systems, is having a big impact on the automotive Ethernet network and gateway function. Automotive Ethernet and gateways do more than support mobile connectivity, they en... » read more

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