tag: Qualcomm

Gap Vs. Gap
By Ed Sperling - 26 Apr, 2012 - Comments: 0

By Ed Sperling Among tools vendors it’s been standard practice to listen closely to customers but not deliver everything they ask for—or at least not always on the customers’ timetable. This strategy has worked well enough for both sides in the past, but at 20nm and in stacked die configurations, the level of tension between these two worlds is increasing, and the gaps in the tool cha... » read more

3D Standards For The Real World
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Pallab Chatterjee Stacking die has progressed from what is technologically possible to what will be realistically feasible in a fabless or fab-lite world. The big challenges may be less about how to deal with stress caused by a TSV or thermal density and more about companies working together in a disaggregated supply chain. This was quite evident at a recent DesignCon panel dicussion on ... » read more

Processor Subject To Change
By Ed Sperling - 09 Feb, 2012 - Comments: 0

By Ann Steffora Mutschler With power complexity driving sophisticated management techniques, SoC design engineering teams are turning to a new class of customizable processor architectures from ARM, CEVA, NVIDIA, Qualcomm and Tensilica and others to take advantage of the best in power saving techniques. While these new architectures are novel approaches, the concepts are not especially new,... » read more

Experts At The Table: Stacked Die And The Supply Chain
By Ed Sperling - 13 Dec, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis ... » read more

Experts At The Table: Stacked Die And The Supply Chain
By Ed Sperling - 05 Dec, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis ... » read more

Experts At The Table: Stacked Die And The Supply Chain
By Ed Sperling - 26 Nov, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis... » read more

Innovation At The Core
By Barry Pangrle - 03 Nov, 2011 - Comments: 0

By Barry Pangrle A number of next-generation ARM-based multi-core systems are starting to show up in the press. Nvidia has released information on its upcoming Tegra 3 (also known as “Kal El”). At last week’s ARM Techcon in Santa Clara, ARM gave several presentations around its Cortex-A7 (Kingfisher) and Cortex-A15 (Eagle) architectures and collectively about its big.LITTLE strategy. Qua... » read more

TSVs Ease Heat In 3D ICs
By Ed Sperling - 08 Sep, 2011 - Comments: 0

By Ann Steffora Mutschler In the evolving discussion of 3D ICs and through silicon via (TSV) technology, a key issue engineering teams are facing today is how to reduce the thermal coefficients between substrates in a stacked die. Simply put, what is the best way to get the heat out of the 2.5 or 3D IC? The answer, of course, is anything but simple. “In a 3D system, the heat hierarchy ... » read more

Dueling Power Formats
By Ed Sperling - 11 Aug, 2011 - Comments: 0

By Ed Sperling Multiple power formats and increasingly complex SoCs don’t sound like a winning formula. So just how bad have things become? Low-Power Engineering asked Sorin Dobre, senior staff engineer at Qualcomm, for a real-world assessment of the situation. LPE: There are three power formats—CPF, UPF and IEEE 1801. How big a problem is this for Qualcomm? Dobre: Actually we have CPF... » read more

Next Up: Touchless Screens
By Kurt Shuler - 28 Jul, 2011 - Comments: 0

By Kurt Shuler Gesture Recognition Qualcomm’s announcement this Monday that it has acquired assets from gesture recognition technology pioneer GestureTek makes it official: Gesture recognition based on video camera technology will be in phones sooner than we think. [caption id="attachment_7583" align="alignnone" width="716"] Source: TI and YouTube[/caption] Video-based gesture recognit... » read more

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