tag: Applied Materials

Enabling Wearable Electronics In The Internet of Things (IoT) Era
By Bharat Ramakrishnan - 20 Mar, 2014 - Comments: 0

As part of its growth focus for Applied Materials, the Office of the CTO (Chief Technology Officer) aims to do the following: Identify, incubate and commercialize growth opportunities in new and adjacent markets Build a culture of open innovation at Applied Materials Address market inflections and high value problems through differentiated solutions Shape the future of our growth mark... » read more

Under The Radar At SPIE
By Mark LaPedus - 20 Mar, 2014 - Comments: 2

At the SPIE Advanced Lithography symposium, the best and brightest minds in the lithography, metrology, resist and design-for-manufacturing (DFM) fields assemble for a week. The annual event is a good way to get a pulse on the current state of lithography. At this year’s SPIE, it was simple to get a reading. Extreme ultraviolet (EUV) lithography remains delayed. The other next-generation l... » read more

Advanced Lithography: Moore’s Law Moves On
By Marc David Levenson - 20 Mar, 2014 - Comments: 1

Every February, experts in nano patterning technologies converge in San Jose, Calif., to present their road maps, brainstorms and results at the SPIE Advanced Lithography Symposium. This year, there was more confusion than ever, partly the result of sessions in unlabeled (but beautiful) new ballrooms at the Convention Center, but mostly because of industry divergences. There is no longer a s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Mar, 2014 - Comments: 0

SanDisk filed a civil suit against Korea’s SK Hynix. Additionally, SanDisk has submitted a criminal complaint with the Tokyo Metropolitan Police Department against a former employee. These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix. Cadence Design Systems and GlobalFoundrie... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Feb, 2014 - Comments: 0

SPIE Advanced Lithography is a patterning show. At the event, however, Applied Materials revealed more details regarding its selective materials removal opportunity, according to Weston Twigg, an analyst with Pacific Crest Securities, in a research note. Applied Materials presented a paper entitled, “Where Is Plasma Etching Going from Here?” “The presenter outlined concepts for thin layer... » read more

Blog Review: Feb. 26
By Ed Sperling - 26 Feb, 2014 - Comments: 0

Got enough time for verification? How about a verification conference? In preparation for DVCon, Real Intent’s Graham Bell grills a panel of experts on where design ends and verification begins. The answer: It depends. Mentor’s Dennis Brophy points to the new version of the Universal Verification Methodology as a reason to attend DVCon next week. Even if you don’t plan to attend, ther... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 21 Feb, 2014 - Comments: 0

Reports have surfaced that IBM’s semiconductor unit is on the block, and there has been discussion about the reasons and the aftermath. Sources say there are at least two potential buyers for the unit—Samsung and TowerJazz. Apparently, the talks between IBM-Samsung and IBM-TowerJazz have been going on for some time. Multiple sources believe that Samsung is interested in buying IBM’s advan... » read more

The Search For The Next Transistor
By Mark LaPedus - 20 Feb, 2014 - Comments: 3

In the near term, the leading-edge chip roadmap looks fairly clear. Chips based on today’s finFETs and planar fully depleted silicon-on-insulator (FDSOI) technologies are expected to scale down to the 10nm node. But then, the CMOS roadmap becomes foggy at 7nm and beyond. The industry has been exploring a number of next-generation transistor candidates, but suddenly, a few technologies are ... » read more

Driving Innovation: From Talk to Action
By Karen Savala - 20 Feb, 2014 - Comments: 0

During the recent SEMI Industry Strategy Symposium, one of the themes focused on the challenges of building an innovative workforce with fresh ideas. KLA CEO and president Rick Wallace’s opening keynote address included an appeal for industry to actively recruit more young talent to foster greater levels of innovative thinking. He said that only four percent of the U.S. workforce is compos... » read more

Interconnect Challenges Grow
By Mark LaPedus - 20 Feb, 2014 - Comments: 0

Qualcomm outlined the technology challenges facing mobile chip suppliers at a recent event. In no particular order, the challenges include the usual suspects—area scaling, power reduction, performance and cost. Another concern for Qualcomm is an often-overlooked part of the equation—the backend-of-the-line (BEOL). In chip production, the BEOL is where the interconnects are formed within ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy