tag: 10nm

Blog Review: April 15
By Jesse Allen - 15 Apr, 2015 - Comments: 0

How much memory do you need to look 13 billion years in the past? Rambus' Aharon Etengoff ponders the Square Kilometre Array's massive number of radio telescopes and what it means for computing. NXP's Martin Schoessler argues that for smart cities to work for their citizens, both technology companies and government entities will need a new mind-set. Reinventing the wheel is a good thing i... » read more

TSMC Tech Tour De Force
By Barry Pangrle - 13 Apr, 2015 - Comments: 0

TSMC held the first of its three North American Tech Symposiums on April 7 in San Jose, with the other two coming up in Boston on April 14 and in Austin on April 16. As was mentioned previously here, the record fast ramp-time of the 20nm node was highlighted among other technological achievements. TSMC also released its March revenue report on April 10, and it shows a dramatic 49.8% increase in... » read more

How We’ll Get There from Here
By Brian Fuller - 09 Apr, 2015 - Comments: 0

The electronics industry is like a battleship with remarkable handling properties. I thought about it this week sitting at an industry event a day after stumbling across Neptune—the technology project, not the god. Those two experiences forced me to rethink some fundamental assumptions about system design and how the ecosystem responds to change. If you’ve not heard of Neptune, it�... » read more

Issues And Options At 5nm
By Mark LaPedus - 19 Mar, 2015 - Comments: 0

While the foundries are ramping up their processes for the 16nm/14nm node, vendors are also busy developing technologies for 10nm and beyond. In fact, chipmakers are finalizing their 10nm process offerings, but they are still weighing the technology options for 7nm. And if that isn’t enough, IC makers are beginning to look at the options at 5nm and beyond. Today, chipmakers can see a p... » read more

How To Extend Litho Scaling
By Ann Mutschler - 19 Feb, 2015 - Comments: 0

IC mask [getkc id="80" comment="lithography"] today is sophisticated and complex. It's also a work in progress with a lot of unknowns as the industry struggles to increase productivity while reducing risk. The bulk of the work currently is focused on trying to figure out what would be a practical scheme for patterning lithography that could be used at 10nm and 7nm, said Gandharv Bhatara, Ca... » read more

3D NAND Market Heats Up
By Mark LaPedus - 19 Feb, 2015 - Comments: 4

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were supposed to ship 3D NAND devices in volumes last year, but vendors pushed out their production dates for various business and technical reasons. Going into 2015, [getentity id="22865" e_nam... » read more

Will 10nm Be The Last Big Node?
By Ed Sperling - 19 Feb, 2015 - Comments: 0

There is a great deal of attention being paid to established nodes these days and everything up to and including 10nm. What comes after that remains a mystery. Intel and a handful of others will keep pushing to the next nodes, of course. Still, where the commercial foundries—including Intel—place their next big bets is a matter of ongoing debate. There is no doubt that 7nm and 5nm will b... » read more

Still Waiting For III-V Chips
By Mark LaPedus - 19 Feb, 2015 - Comments: 0

For years, chipmakers have been searching for an alternative material to replace traditional silicon in the channel for advanced CMOS devices at 7nm and beyond. There’s a good reason, too: At 7nm, silicon will likely run out of steam in the channel. Until recently, chipmakers were counting on III-V materials for the channels, at least for NFET. Compared to silicon, III-V materials provide ... » read more

Low Power Trends Toward FinFET
By Mary Ann White - 12 Feb, 2015 - Comments: 0

My previous blog, Power Reduction Techniques, covered which low power techniques were applicable for various process nodes, from larger planar CMOS process technologies through finFET. The 16 and 14nm finFET-based process nodes are moving into production this year, and we are seeing many companies rapidly move their designs to finFET. In my last post, I noted some of the reasons why finFET is s... » read more

Manufacturing And Packaging Changes For 2015
By Brian Bailey - 22 Jan, 2015 - Comments: 0

This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

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