What Just Happened?


Boy that went by fast. One minute, I’m waking up a little groggy on New Year’s Day, wondering whether the silicon industry is ever going to rebound. The next minute, it’s today and the industry had a good year, and is, in many ways, a completely different animal than it was 12 months ago. Innovation is evolutionary, sure. But if you really think about 2013, you can make an argument tha... » read more

The “Last Simple Node” And the Internet of Things


Power, performance and size are key targets that will enable the expected explosion of the Internet of Things (IoT). Today, most observers see the path to that running directly through 16/14nm finFET and below for the node’s ability to manage power and size and boost integration. Geoff Lees isn’t your average observer. The vice president and general manager of Freescale’s microcon... » read more

Fundamentals For 3D IC Flows


While true 3D ICs are a few years off, 2.5D is here. There are some key differences, namely that with 2.5D the interposer is a passive die, but there also are some fundamental shared requirements. Samta Bansal, senior product marketing for Silicon Realization at Cadence asserted that first, the digital, custom and package environments must be seamless. “There has to be a co-design between ... » read more

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