tag: 5G

mmWave Chip, Package, And Board Beamforming Solutions
By Cadence - 31 Mar, 2021 - Comments: 0

RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. 5G data rates exceeding 1GB/s will be supported by the available bandwidth in the millimeter-wave (mmWave) spectrum and ... » read more

Meeting The Challenges Of 5G RF Production Test Services
By Vineet Pancholi - 18 Mar, 2021 - Comments: 0

Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there has been an increased focus on publications and products that have been introduced to the marketplace. Some of the more popular RF eco-system applications include cellphone, Wi-Fi, automotive, Internet of Things (IoT), location services, and more. Wi-Fi and cellphone servi... » read more

Chiplets For The Masses
By Brian Bailey - 03 Mar, 2021 - Comments: 2

Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

5G NR Design For eMBB
By Cadence - 24 Feb, 2021 - Comments: 0

This white paper examines the design challenges for eMBB products and provides examples of how these challenges can be overcome using the co-design capabilities in Cadence AWR Design Environment software. Click here to download with registration. » read more

Shortages, Challenges Engulf Packaging Supply Chain
By Mark LaPedus - 18 Feb, 2021 - Comments: 0

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Packaging Demands For RF And Microwave Devices
By Ken Molitor - 18 Feb, 2021 - Comments: 1

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

Bridging The Gap Between Smart Cities And Autonomous Vehicles
By Ann Mutschler - 04 Feb, 2021 - Comments: 0

Smart city planners and carmakers are wrestling with similar problems and goals, but they are working at very different paces and often with different technologies — despite the fact that these two worlds will need to be bridged in order to be useful. Moving traffic optimally in urban areas is critical for reducing energy consumption and accidents, and for moving emergency vehicles through... » read more

5G as a wireless power grid
By Technical Paper Link - 31 Jan, 2021 - Comments: 0

Abstract "5G has been designed for blazing fast and low-latency communications. To do so, mm-wave frequencies were adopted and allowed unprecedently high radiated power densities by the FCC. Unknowingly, the architects of 5G have, thereby, created a wireless power grid capable of powering devices at ranges far exceeding the capabilities of any existing technologies. However, this potential c... » read more

Taming Non-Predictable Systems
By Brian Bailey - 28 Jan, 2021 - Comments: 0

How predictable are semiconductor systems? The industry aims to create predictable systems and yet when a carrot is dangled, offering the possibility of faster, cheaper, or some other gain, decision makers invariably decide that some degree of uncertainty is warranted. Understanding uncertainty is at least the first step to making informed decisions, but new tooling is required to assess the im... » read more

The Good, Bad And Unknowns Of Flexible Devices
By Ed Sperling - 27 Jan, 2021 - Comments: 0

Flexible hybrid electronics are beginning to proliferate in consumer, medical, and industrial applications due to their comparatively low weight, thin profile, and the ability to literally bend the rules of design. Open any smart phone today and you're likely to find one or more of these flexible boards. Unlike standard printed circuit boards, FHE devices are printed using a combination of r... » read more

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