A Novel Complementary Architecture of One-time-programmable Memory and Its Applications as Physical Unclonable Function (PUF) and One-time Password


Abstract "For the first time, we proposed a 2T complementary architecture of one-time-programmable memory (OTP) in a foundry logic CMOS chip. It was then used to realize the PUF (Physical unclonable function), and the combination with the AI technology to provide a one-time password capability. At first, an OTP was developed based on a novel 2T CMOS unit cell. The experimental results show t... » read more

Xilinx AI Engines And Their Applications


This white paper explores the architecture, applications, and benefits of using Xilinx's new AI Engine for compute intensive applications like 5G cellular and machine learning DNN/CNN. 5G requires between five to 10 times higher compute density when compared with prior generations; AI Engines have been optimized for DSP, meeting both the throughput and compute requirements to deliver the hig... » read more

mmWave Chip, Package, And Board Beamforming Solutions


RF front-end architectures grow more complex with each generation of communication systems. To accommodate these architectures, more densification and miniaturization is taking place with electronic systems implemented through innovations in system-in-package (SiP) design. 5G data rates exceeding 1GB/s will be supported by the available bandwidth in the millimeter-wave (mmWave) spectrum and ... » read more

Meeting The Challenges Of 5G RF Production Test Services


Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there has been an increased focus on publications and products that have been introduced to the marketplace. Some of the more popular RF eco-system applications include cellphone, Wi-Fi, automotive, Internet of Things (IoT), location services, and more. Wi-Fi and cellphone servi... » read more

Chiplets For The Masses


Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That's changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your system remains uncertain. While new fabrication nodes continue to be developed, scaling is coming to an end, be it for physical or e... » read more

5G NR Design For eMBB


This white paper examines the design challenges for eMBB products and provides examples of how these challenges can be overcome using the co-design capabilities in Cadence AWR Design Environment software. Click here to download with registration. » read more

Shortages, Challenges Engulf Packaging Supply Chain


A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Packaging Demands For RF And Microwave Devices


RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

Bridging The Gap Between Smart Cities And Autonomous Vehicles


Smart city planners and carmakers are wrestling with similar problems and goals, but they are working at very different paces and often with different technologies — despite the fact that these two worlds will need to be bridged in order to be useful. Moving traffic optimally in urban areas is critical for reducing energy consumption and accidents, and for moving emergency vehicles through... » read more

5G as a wireless power grid


Abstract "5G has been designed for blazing fast and low-latency communications. To do so, mm-wave frequencies were adopted and allowed unprecedently high radiated power densities by the FCC. Unknowingly, the architects of 5G have, thereby, created a wireless power grid capable of powering devices at ranges far exceeding the capabilities of any existing technologies. However, this potential c... » read more

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