tag: Cadence

Week In Review: Design, Low Power
By Karen Heyman - 26 May, 2023 - Comments: 0

Cadence bought Pulsic, a U.K.-based developer of place-and-route tools for custom digital and analog. The acquisition follows a previous acquisition attempt by a Chinese firm in August 2022, which was blocked by the U.K. government. At the G7 Summit in Japan, IBM announced a 10-year, $100 million initiative with the University of Tokyo and the University of Chicago to develop a quantum-centr... » read more

Chiplet Planning Kicks Into High Gear
By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

IP Becoming More Complex, More Costly
By Brian Bailey - 25 May, 2023 - Comments: 0

Success in the semiconductor intellectual property (IP) market requires more than a good bit of RTL. New advances mandate a complete design, implementation, and verification team, which limits the number of companies competing in this market. What constitutes an IP block has changed significantly since the concept was first introduced in the 1990s. What was initially just a piece of RTL (reg... » read more

The History Of CMOS
By Paul McLellan - 25 May, 2023 - Comments: 0

Since CMOS has been around for about 50 years, a comprehensive history would be a book. This blog focuses on what I consider the major transitions. NMOS Before CMOS, there was NMOS (also PMOS, but I have no direct experience with that). An NMOS gate consisted of a network of N-transistors between the output and Vss, and a resistor (actually a transistor with an implant) between the output and... » read more

Blog Review: May 24
By Jesse Allen - 24 May, 2023 - Comments: 0

Siemens' Patrick McGoff finds that designers have not had easy tools to address solderability, leaving a critical part of the manufacturing success of a PCB to the component engineer or the contract manufacturer, and points to manufacturing-driven design as a way to avoid quality issues later. Cadence's Rich Chang finds that effective UPF low-power verification and debug involves more than o... » read more

Celsius EC Solver
By Cadence - 24 May, 2023 - Comments: 0

The Cadence Celsius EC Solver is electronics cooling simulation software for accurate and fast analysis of the thermal performance of electronic systems. It enables electronic system designers to accurately address the most challenging thermal/electronics cooling issues today. The Celsius EC Solver utilizes a powerful computational engine and meshing technology that enables designers to model a... » read more

Chips Getting More Secure, But Not Quickly Enough
By Ed Sperling - 22 May, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of heterogeneous integration, more advanced RISC-V designs, and a growing awareness of security threats, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketin... » read more

Blog Review: May 17
By Jesse Allen - 17 May, 2023 - Comments: 0

Synopsys' Dana Neustadter examines the key industries driving Ethernet security, challenges to securing Ethernet networks, and the MACsec protocol that guards against network data breaches by encrypting data traffic between Ethernet-connected devices. Siemens' Stephen Chavez points to the improvements gained from design reuse in PCB design but warns that inefficient processes for managing an... » read more

Machine Vision Plus AI/ML Adds Vast New Opportunities
By John Koon - 17 May, 2023 - Comments: 0

Traditional technology companies and startups are racing to combine machine vision with AI/ML, enabling it to "see" far more than just pixel data from sensors, and opening up new opportunities across a wide swath of applications. In recent years, startups have been able to raise billions of dollars as new MV ideas come to light in markets ranging from transportation and manufacturing to heal... » read more

Holistic Power Reduction
By Brian Bailey - 11 May, 2023 - Comments: 0

The power consumption of a device is influenced by every stage of the design, development, and implementation process, but identifying opportunities to save power no longer can be just about making hardware more efficient. Tools and methodologies are in place for most of the power-saving opportunities, from RTL down through implementation, and portions of the semiconductor industry already a... » read more

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