tag: chiplets

IP Industry Transformation
By Brian Bailey - 09 Jun, 2022 - Comments: 0

The design IP industry is developing an assortment of new options and licensing schemes that could affect everything from how semiconductor companies collaborate to how ICs are designed, packaged, and brought to market. The IP market already has witnessed a sweeping shift from a "design once, use everywhere" approach, to an "architect once, customize everywhere" model, in which IP is highly ... » read more

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Who Benefits From Chiplets, And When
By Ed Sperling - 31 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss new packaging approaches and integration issues with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a... » read more

Standardizing Chiplet Interconnects
By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability
By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

Chiplets: Current Status
By Andy Heinig - 12 May, 2022 - Comments: 0

Recent weeks have seen a number of interesting developments in the area of chiplets. An increasing number of products based on chiplets have been brought to market, especially in the processors segment. For example, Apple and AMD now have processors with chiplets on the market and under production in high volumes. On one hand, this means that sufficient production capacity has now been built up... » read more

Lots Of Data, But Uncertainty About What To Do With It
By Ed Sperling - 09 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management in heterogeneous designs, where sensors produce a flood of data, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University... » read more

Chip Industry Heads Toward $1T
By Ed Sperling - 27 Apr, 2022 - Comments: 0

The chip industry is on track to hit $1 trillion sometime over the next decade, and while the exact timing depends on a variety of factors, the trend line appears to be stable. The digitization of data, the digitalization of technology, and the expansion into new and existing markets, collectively are expected to drive chip industry growth for years to come. Exactly when the IC world will to... » read more

Paving The Way To Chiplets
By Mark LaPedus - 25 Apr, 2022 - Comments: 2

The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

Big Changes In Materials And Processes For IC Manufacturing
By Ed Sperling And Laura Peters - 21 Apr, 2022 - Comments: 3

Rama Puligadda, CTO at Brewer Science, sat down with Semiconductor Engineering to talk about a broad set of changes in semiconductor manufacturing, packaging, and materials, and how that will affect reliability, processes, and equipment across the supply chain. SE: What role do sacrificial materials play in semiconductor manufacturing, and how is that changing at new process nodes? Puliga... » read more

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