tag: chiplets

ECTC Packaging Trends
By Mark LaPedus - 10 Jun, 2019 - Comments: 0

At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC packaging technologies. The event provided a glimpse of the future of packaging, which is becoming more important in the industry. At one time, IC packaging took a backseat in the semiconductor... » read more

Meltdown, Spectre And Foreshadow
By Ed Sperling - 03 Jun, 2019 - Comments: 0

Ben Levine, senior director of product management for Rambus’ Security Division, talks with Semiconductor Engineering about hardware-specific attacks, why they are so dangerous, and how they work. » read more

Chiplet Momentum Builds, Despite Tradeoffs
By Brian Bailey - 13 May, 2019 - Comments: 0

Chip design is a series of tradeoffs. Some are technical, others are related to cost, competitive features or legal restrictions. But with the nascent 'chiplet' market, many of the established balance points are significantly altered, depending on market segments and ecosystem readiness. Chiplets provide an alternative mechanism for integrating intellectual property (IP) blocks into a semico... » read more

Creating A Roadmap For Hardware Security
By Kevin Fogarty and Ed Sperling - 02 May, 2019 - Comments: 0

The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

Manufacturing Bits: April 23
By Mark LaPedus - 23 Apr, 2019 - Comments: 0

Sorting nuclei CERN and GSI Darmstadt have begun testing the first of two giant magnets that will serve as part of one of the largest and most complex accelerator facilities in the world. CERN, the European Organization for Nuclear Research, recently obtained two magnets from GSI. The two magnets weigh a total of 27 tons. About 60 more magnets will follow over the next five years. These ... » read more

Moore’s Law Now Requires Advanced Packaging
By Ed Sperling - 18 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Blog Review: April 17
By Jesse Allen - 17 Apr, 2019 - Comments: 0

In a video, Mentor's Colin Walls digs into power management in embedded software with a particular look at the Power Pyramid model. Synopsys' Taylor Armerding checks out the state of application security at this year's RSA and finds that while organizations are paying attention to security through training and dedicated teams, roadblocks still remain. Cadence's Paul McLellan considers how... » read more

Chiplets – Taking SoC Design Where No Monolithic IC Has Gone Before
By Achronix - 03 Apr, 2019 - Comments: 0

The chiplet movement is a reaction to the rapidly changing IC landscape and the current IC fabrication realities. Engineers are increasingly realizing that it makes little sense to integrate every IP block in a system on one piece of silicon if the fit is poor. There are many advantages with monolithic silicon integration, but those advantages are rapidly being outweighed by the economics of bu... » read more

Making Chip Packaging Simpler
By Ed Sperling and Mark LaPedus - 21 Mar, 2019 - Comments: 1

Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

The Data Deluge
By Ed Sperling - 23 Jan, 2019 - Comments: 0

Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to discuss the intersection of big data and technology, from the data center to the edge and vertical markets such as automotive. What follows are excerpts of that conversation. SE: What are the biggest changes you've seen over the past year? Tan: We are moving quickly toward data-driven economics. There... » read more

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