tag: DSA

DSA Method Of 3D Interconnected Structures In Thin Films (MIT)
By Technical Paper Link - 25 Nov, 2025 - Comments: 0

A new technical paper titled "Directed self-assembly of 3D interconnected networks" was published by researchers at MIT. Abstract: "Directed self-assembly (DSA) of block copolymers (BCPs) has long been included in the semiconductor roadmap as a lithographic pathway to enable continued device scaling. Tremendous progress has been made in generating two-dimensional (2D) BCP patterns with devi... » read more

An Overview Of Recent Progress On The EUV + DSA Strategy (Univ. of Chicago, Berkeley Lab, Argonne)
By Technical Paper Link - 28 Oct, 2025 - Comments: 0

A new technical paper titled "Directed self-assembly of block copolymers for high-precision patterning in the era of extreme ultraviolet lithography" was published by researchers at University of Chicago, Lawrence Berkeley National Laboratory and Argonne National Laboratory. Abstract "Extreme ultraviolet (EUV) lithography enables unprecedented resolution in semiconductor patterning but face... » read more

Averting Hacks Of PCIe Transport Using CMA/SPDM
By Siemens EDA - 09 Jan, 2025 - Comments: 0

This paper describes the component measurement and authentication (CMA) and security protocol and data model (SPDM) flow used to establish the secure channels required for the transmission of encrypted packets. The various approaches, namely the symmetric and asymmetric flows, will be discussed in establishing a secure connection with the implementation of CMA/SPDM packets through data objects.... » read more

CMA/SPDM—An Additional Layer of Security for PCIe Transport
By Suprio Biswas - 10 Oct, 2024 - Comments: 0

In today’s data-driven world, everyone is navigating a vast ocean of information that transcends across unsecured links and can easily fall prey to digital hackers. To keep our data safe, it is crucial to beef up security and make sure that only the right users can access our data. This article dives into the world of secure communication, where component measurement and authentication (CM... » read more

Framework for Prototyping And In-Hardware Evaluation of Post-Quantum Cryptography HW Accelerators (TU Darmstadt)
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “PQC-HA: A Framework for Prototyping and In-Hardware Evaluation of Post-Quantum Cryptography Hardware Accelerators” was published by researchers at TU Darmstadt. Abstract: "In the third round of the NIST Post-Quantum Cryptography standardization project, the focus is on optimizing software and hardware implementations of candidate schemes. The winning schemes are ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 18 Aug, 2023 - Comments: 0

Intel dropped out of a $5.4 billion deal to purchase Tower Semiconductor in Israel. Intel cited the inability to obtain regulatory approval in a timely manner as the reason for ending the deal signed in February. Intel will pay a $353 million termination fee to Tower. The silicon wafer supply has moved back into positive territory for 2023 thanks to a 7% decline in wafer shipments combined w... » read more

Directed Self-Assembly Finds Its Footing
By Gregory Haley - 17 Aug, 2023 - Comments: 0

Ten years ago, when the industry was struggling to deliver EUV lithography, directed self-assembly (DSA) roared to the forefront of research and development for virtually every manufacturer determined to extend the limits of 193i. It was the hot topic at of the 2012 SPIE Advanced Lithography Conference, with one attendee from Applied Materials comparing its potential to disrupt the industry to ... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Define & Grow III–V Vertical Nanowires At A High Footprint Density on a Si Platform
By Technical Paper Link - 29 Jul, 2022 - Comments: 0

New technical paper titled "Directed Self-Assembly for Dense Vertical III–V Nanowires on Si and Implications for Gate All-Around Deposition" is published from researchers at Lund University in Sweden. Abstract: "Fabrication of next generation transistors calls for new technological requirements, such as reduced size and increased density of structures. Development of cost-effective proc... » read more

Manufacturing Bits: Nov. 2
By Mark LaPedus - 02 Nov, 2021 - Comments: 0

IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

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