tag: Intel

New Uses For AI In Chips
By John Koon and Ed Sperling - 11 Aug, 2022 - Comments: 1

Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Cryogenic CMOS Becomes Cool
By Brian Bailey - 11 Aug, 2022 - Comments: 1

Cryogenic CMOS is a technology on the cusp, promising higher performance and lower power with no change in fabrication technology. The question now is whether it becomes viable and mainstream. Technologies often appear to be just on the horizon, not quite making it, but never too far out of sight. That's usually because some issue plagues it, and the incentive is not big enough to solve the ... » read more

Side-Channel Attack “Binoculars” Exploits Interactions Between HW Page Walk Operations & Other Memory Operations
By Technical Paper Link - 10 Aug, 2022 - Comments: 0

New technical paper titled "Binoculars: Contention-Based Side-Channel Attacks Exploiting the Page Walker" was presented by researchers at University of Illinois Urbana-Champaign and Tel Aviv University at the USENIX Security Symposium in Boston in August 2022. Abstract: "Microarchitectural side channels are a pressing security threat. These channels are created when programs modulate hardw... » read more

Week In Review, Manufacturing, Test
By Karen Heyman - 05 Aug, 2022 - Comments: 1

Post-CHIPS Act Micron is discussing a potential new fab that could employ thousands of workers, following the passage of the Chips and Science Act. Idaho is hoping it will be built near its headquarters facilities in Boise, but Micron hasn’t committed publicly. Rob Beard, senior vice president, general counsel and corporate secretary at Micron, told the Idaho Statesman the company is consi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 05 Aug, 2022 - Comments: 0

Pervasive computing, connectivity Semtech Corporation announced that it will acquire Sierra Wireless, an IoT services company. The acquisition will combine Semtech’s LoRa end nodes and cloud service with Sierra Wireless’ cellular capabilities. Telit will incorporate Thales’s cellular IoT products business under a new name Telit Cinterion, led by Telit. Telit Cinterion will be Californ... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 29 Jul, 2022 - Comments: 1

The U.S. Congress approved the CHIPS Act, a mammoth bipartisan achievement the New York Times called “the most significant government intervention in industrial policy in decades.” As passed, the full package — now called the Chips and Science Act — contains $52 billion in direct assistance for the semiconductor industry, along with $24 billion in tax incentives. In addition, the bill c... » read more

Customizing Processors
By Brian Bailey - 28 Jul, 2022 - Comments: 1

The design, verification, and implementation of a processor is the core competence of some companies, but others just want to whip up a small processor as quickly and cheaply as possible. What tools and options exist? Processors range from very small, simple cores that are deeply embedded into products to those operating at the highest possible clock speeds and throughputs in data centers. I... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

New Materials Open Door To New Devices
By Katherine Derbyshire - 21 Jul, 2022 - Comments: 0

Integrating 2D materials into conventional semiconductor manufacturing processes may be one of the more radical changes in the chip industry’s history. While there is pain and suffering associated with the introduction of any new materials in semiconductor manufacturing, transition metal dichalcogenides (TMDs) support a variety of new device concepts, including BEOL transistors and single-... » read more

Customization, Heterogenous Integration, And Brute Force Verification
By Ed Sperling - 14 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

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