tag: Intel

Inevitable Bugs
By Brian Bailey - 29 Apr, 2020 - Comments: 3

Are bug escapes inevitable? That was the fundamental question that Oski Technology recently put to a group of industry experts. The participants are primarily simulation experts who, in many cases, help direct the verification directions for some of the largest systems companies. In order to promote free discussion, all comments have been anonymized, distilling the primary thoughts of the parti... » read more

Blog Review: April 29
By Jesse Allen - 29 Apr, 2020 - Comments: 0

Arm's Paul Whatmough checks out SCALE-Sim, an open source cycle-accurate simulator specifically for neural processing unit (NPU) architectures. Mentor's Neil Johnson shows how a complete verification methodology requires complementary deployment of multiple techniques, with different options at each level of abstraction. Cadence's Paul McLellan checks out challenges in automotive reliabil... » read more

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2020 - Comments: 1

Gate-all-around reliability The 2020 IEEE International Reliability Physics Symposium (IRPS) will kick off this week, this time as a virtual event. IRPS is a conference that focuses on the latest research in microelectronics reliability. The event starts off with keynotes from Infineon, Intel and Texas Instruments. IRPS also involves a multitude of papers and presentations. On the logi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Apr, 2020 - Comments: 0

Chipmakers Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. There are already signs that the foundries have pushed out their 3nm production schedules. So, expect 7nm and 5nm to become long-running nodes. At 3nm, Samsung and TSMC are going in different directions. Samsung is developing a gate-all-around (GAA) technology called nanosheet FETs. TSMC will e... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 24 Apr, 2020 - Comments: 0

PCs get work-from-home bump Rather than using Intel chips, Apple will be making its own chips for its Mac computers, using Arm cores, Bloomberg reports. TSMC will manufacture the chips. Intel, meanwhile, was up 14% quarter year-over-year its PC business, which it attributes to more people working from home and needed new equipment. Despite a strong quarter, however, the company pulled its 2... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Apr, 2020 - Comments: 0

COVID-19, IoT Last week, the United States’ Department of Health and Human Service (HHS) announced it will not enforce penalties for certain U.S. HIPAA Rules violations involving COVID-19 testing sites. HIPAA, the Health Insurance Portability and Accountability Act of 1996, protects privacy of health information. Lawyers are looking it over. "Even during the COVID-19 pandemic, providers are ... » read more

Taking A Pulse On The IC Biz
By Mark LaPedus - 16 Apr, 2020 - Comments: 0

It’s been a difficult period for the semiconductor industry. The coronavirus outbreak has put a damper on what was supposed to be a strong year in the semiconductor industry in 2020. Many are holding out hopes for a rebound in the second half of the year. That’s still a big unknown. The forecasts are gloomy. For example, VLSI Research has three different scenarios for the semiconduc... » read more

Metrology Challenges For Gate-All-Around
By Mark LaPedus - 16 Apr, 2020 - Comments: 3

Metrology is proving to be a major challenge for those foundries working on processes for gate-all-around FETs at 3nm and beyond. Metrology is the art of measuring and characterizing structures in devices. Measuring and characterizing structures in devices has become more difficult and expensive at each new node, and the introduction of new types of transistors is making this even harder. Ev... » read more

Making Chips At 3nm And Beyond
By Mark LaPedus and Ed Sperling - 16 Apr, 2020 - Comments: 4

Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

Big Changes In Tiny Interconnects
By Ed Sperling - 16 Apr, 2020 - Comments: 1

One of the fundamental components of a semiconductor, the interconnect, is undergoing radical changes as chips scale below 7nm. Some of the most pronounced shifts are occurring at the lowest metal layers. As more and smaller transistors are packed onto a die, and as more data is processed and moved both on and off a chip or across a package, the materials used to make those interconnects, th... » read more

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