tag: interconnect

Interconnect Challenges Grow, Tools Lag
By Brian Bailey - 15 Jun, 2020 - Comments: 2

Interconnects are becoming much more problematic as devices shrink and the amount of data being moved around a system continues to rise. This limitation has shown up several times in the past, and it's happening again today. But when the interconnect becomes an issue, it cannot be solved in the same way issues are solved for other aspects of a chip. Typically it results in disruption in how ... » read more

eFPGA As Fast And Dense As FPGA, On Any Process Node
By Geoff Tate - 04 Jun, 2020 - Comments: 0

A challenge for eFPGA when we started Flex Logix is that there are many customers and applications, and they all seemed to want eFPGA on different foundries, different nodes and different array sizes. And everyone wanted the eFPGA to be as fast and as dense as FPGA leaders’ on the same node. Oh, and customers seem to wait to the last minute then need the eFPGA ASAP. Xilinx and Altera (Intel ... » read more

The Need For 3D IC Packaging And Design Evolution
By Rita Horner - 14 May, 2020 - Comments: 0

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device physics limitations. Regardless of how well transistor counts continue to scale, market segments continue to drive the thirst for more compute performance and fast time to markets. Artificial i... » read more

Which Chip Interconnect Protocol Is Better?
By Ed Sperling - 11 May, 2020 - Comments: 0

Semiconductor Engineering sat down to the discuss the pros and cons of the Compute Express Link (CXL) and the Cache Coherent Interconnect for Accelerators (CCIX) with Kurt Shuler, vice president of marketing at Arteris IP; Richard Solomon, technical marketing manager for PCI Express controller IP at Synopsys; and Jitendra Mohan, CEO of Astera Labs. What follows are excerpts of that conversation... » read more

AI, Performance, Power, Safety Shine Spotlight On Last-Level Cache
By Kurt Shuler - 02 Apr, 2020 - Comments: 0

Memory limitations to performance, always important in modern systems, have become an especially significant concern in automotive safety-critical applications making use of AI methods. On one hand, detecting and reporting a potential collision or other safety problem has to be very fast. Any corrective action is constrained by physics and has to be taken well in advance to avoid the problem. ... » read more

Software In Inference Accelerators
By Ed Sperling - 10 Feb, 2020 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about the importance of hardware-software co-design for inference accelerators, how that affects performance and power, and what new approaches chipmakers are taking to bring AI chips to market. » read more

Analog Simulation At 7/5/3nm
By Ed Sperling - 27 Jan, 2020 - Comments: 0

Hany Elhak, group director of product management at Cadence, talks with Semiconductor Engineering about analog circuit simulation at advanced nodes, why process variation is an increasing problem, the impact of parasitics and finFET stacking, and what happens when gate-all-around FETs are added into the chip. » read more

Verdi Transaction Debug Solution: Unified Performance Analysis And Debug For Interconnect
By Synopsys - 13 Nov, 2019 - Comments: 0

In modern systems on chip (SoCs), where Arm AMBA protocols are intensively used as standard intellectual property (IP) interfaces, the interconnect is usually required to bridge and facilitate the communication between many different IP interfaces. The interconnect presents one of the biggest challenges of SoC verification, considering the different kinds of protocol interfaces, conversion of d... » read more

Accelerating Chiplets With 112G XSR SerDes PHYs
By Nhat Nguyen - 31 Oct, 2019 - Comments: 0

The fading of Moore’s Law and an almost exponential increase in data is challenging the semiconductor industry as never before. Indeed, zettabytes of data are constantly generated by a wide range of devices including IoT endpoints such as vehicles, wearables, smartphones and appliances. Moreover, sophisticated artificial intelligence (AI) and machine learning (ML) applications are adding new ... » read more

Interconnect Prominence In Fail-Operational Architectures
By Kurt Shuler - 02 May, 2019 - Comments: 0

When we in the semiconductor world think about safety, we think about ISO 26262, FMEDA and safety mechanisms like redundancy, ECC and lock-step operation. Once we have that covered, any other aspect of safety is somebody else’s problem, right? Sadly no, for us at least. As we push towards higher levels of autonomy, SAE levels 3 and above, we’re integrating more functionality into our SoCs, ... » read more

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