Packaging Biz Faces Challenges in 2019

By Mark LaPedus - 10 Dec, 2018 - Comments: 0

The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 21 Nov, 2018 - Comments: 0

Internet of Things Forrester Research released its 2019 Internet of Things predictions. Some key points: Bundled service offerings will catalyze a sleepy consumer IoT market; cybercriminals will lay siege to a smart-city implementation; and a market for IoT managed services will emerge in 2019. Black Friday and Cyber Monday are coming up. Those days present some opportunities to purchase ... » read more

Foundries Prepare For Battle At 22nm

By Mark LaPedus - 19 Nov, 2018 - Comments: 0

After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

New Opportunities For OTP NVM

By Melissa Kirschner - 01 Nov, 2018 - Comments: 0

By 2020 more than 50 billion devices will be connected to the Internet, according to Cisco’s latest forecast. Smartphone traffic will exceed PC traffic and broadband speeds will nearly double by 2021. And by the next Winter Olympics (Beijing 2022), 1 trillion networked sensors could be embedded in the world around us. While tech experts offer slightly different projections of actual numbers,... » read more

Zeno Semi Expands On-Chip Memory

By Kevin Fogarty - 30 Oct, 2018 - Comments: 0

San Jose, Calif.-based startup Zeno Semiconductor is testing modifications and a smaller process node for the single-transistor 28nm SRAM chip it introduced in 2016, which could boost space for on-chip CPU memory by more than 2.5X, according to the co-founder and CEO of the company, Yuniarto Widjaja. The Zeno-1 transistor is built on standard CMOS processes, has a bi-stable bipolar transisto... » read more

3D NAND: Challenges Beyond 96-Layer Memory Arrays

By Steve Shih-Wei Wang - 24 Oct, 2018 - Comments: 0

Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the first V-NAND product using 24 layers and MLC [1]. Five years later, in 2018, vendors of 3D-NAND have all announced production plans for 96-Layer NAND using TLC [2]. According to recent news reports, vendors are already working ... » read more

Digging Deep Into High Aspect Ratio Process Control For Memory Technology

By Mark Shirey - 18 Oct, 2018 - Comments: 0

By Mark Shirey and Janay Camp Data is an integral part of our lives. Contrary to the past, where files had to be removed periodically to free up storage space, we now assume that our data will never be deleted. Why risk deleting the wrong file? Just keep them! This new approach consumes a lot of memory, and intensifies the demand for storage. Two of the main workhorses of the memory segment ... » read more

Blog Review: Oct. 17

By Jesse Allen - 17 Oct, 2018 - Comments: 0

Arm's Shidhartha Das explores the challenges of power delivery in designing mobile systems and the importance of focusing on peak power consumption. Synopsys' Meenakshy Ramachandran explains the basics of Display Stream Compression and how it works to increase the effective bandwidth enabling support of high resolution displays. Cadence's Paul McLellan shares tips on more effective market... » read more

Making AI Run Faster

By Ed Sperling - 11 Oct, 2018 - Comments: 0

The semiconductor industry has woken up to the fact that heterogeneous computing is the way forward and that inferencing will require more than a GPU or a CPU. The numbers being bandied about by the 30 or so companies working on this problem are 100X improvements in performance. But how to get there isn't so simple. It requires four major changes, as well as some other architectural shifts. ... » read more

Blog Review: Oct. 10

By Jesse Allen - 10 Oct, 2018 - Comments: 0

In a video, Cadence's Megha Daga dives into sparsity in neural networks and how it affects bandwidth, performance, and power efficiency. In a video, Mentor's Colin Walls takes a look at efficient embedded code, and why that means different things at different times. Synopsys' Eric Huang argues that in the realm of video standards, HDMI, DisplayPort, and USB Type-C are set to continue comp... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: memory