tag: test

Test Moving Forward And Backward
By Ed Sperling - 11 Jun, 2019 - Comments: 0

Test, once considered an important but rather mundane way of separating good chips from the not-so-good and the total rejects, is taking on a whole new life. After decades of largely living in the shadows behind design and advancements in materials and lithography, test has quietly shifted into a much more critical and more public role. But it has taken several rather significant shifts acro... » read more

Tessent Hierarchical ATPG Reference Flow for Arm Cortex-A75
By Mentor, a Siemens Business - 11 Jun, 2019 - Comments: 0

Arm and Mentor have jointly developed a reference flow for a hierarchical DFT and ATPG implementation with Tessent for any Arm subsystem based on Cortex A-series IP. The reference flow, described in this paper, provides documentation, seamless interfaces, and scripts that accelerate the implementation of a hierarchical test solution. Arm and Mentor are dedicated to enabling customer success, re... » read more

5G Drives New Test Approaches
By Kevin Fogarty - 11 Jun, 2019 - Comments: 0

Test/validation providers are claiming steady progress in the race to deliver 5G network components that support millimeter-wave as well as lower-frequency networks. Going from a state of no existing off-the-shelf test equipment suitable for 5G standalone new radio (NR), test companies are introducing equipment that can handle mmWave component testing on a limited scale. 5G is a next-generat... » read more

ATE Lab To Fab
By Ed Sperling - 05 Jun, 2019 - Comments: 2

Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw     See other tech talk videos here » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 31 May, 2019 - Comments: 0

Trade wars The trade war between the United States and China is escalating and it is here to stay. Victor Davis Hanson, a senior fellow at think tank Hoover Institution, said the United States is at a crossroads with China. It could define America’s security and the international order for decades to come. Here’s the latest blog on trade tensions between the U.S. and China. “Tensions ... » read more

Why IP Quality Is So Difficult To Determine
By Ann Mutschler - 30 May, 2019 - Comments: 0

Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends up on how and where it is used and in part because even the best IP may work better in one system than another—even in chips developed by the same vendor. This has been one of the challenges with IP over the years. In many cases, IP is poorly characterized, regardless of whether that IP wa... » read more

Analog Fault Simulation
By Ed Sperling - 30 May, 2019 - Comments: 0

Anand Thiruvengadam, senior staff product marketing manager at Synopsys, drills down into the need for fault simulation in analog circuits in automotive designs. » read more

Can The Hardware Supply Chain Remain Secure?
By Andy Patrizio - 15 May, 2019 - Comments: 2

Malware in computers has been a reality since the 1990s, but lately the focus has shifted to hardware. So far, the semiconductor industry has been lucky because well-publicized threats were either limited or unproven. But sooner or later, luck runs out. Last year saw two significant incidents that shook people’s faith in the integrity of hardware security. The first was the Meltdown/Spectr... » read more

Next-Generation Vehicles Pose Automotive Semiconductor Test Challenges
By Advantest - 07 May, 2019 - Comments: 0

Various market trends are driving requirements for automotive semiconductor test as technology increasingly defines the future of the automobile. According to IHS Markit, the total market for semiconductors, having reached nearly $500 billion in 2018, will grow at a CAGR of 4.88% through 2022, while the automotive electronics category, reaching more than $40 billion in 2018, will outpace the to... » read more

Hidden Soldier Joints Inspection: 4 Case Studies
By DELTA, a part of FORCE Technology - 07 May, 2019 - Comments: 0

IC packaging technologies are becoming smaller and thinner. Ball grid array (BGA) packages were introduced some years ago in order to save space on the PCB, and are now widely used. To overcome the resulting problems with using optical microscopy as an inspection tool, the endoscope found its way into quality engineering departments. To read more, click here. » read more

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