tag: advanced packaging

Is There A Crossover Point For Mainstream Anymore?
By Ed Sperling - 21 Nov, 2019 - Comments: 0

Until 28nm, it was generally assumed that process nodes would go mainstream one or two generations after they were introduced. So by the time the leading edge chips for smartphones and servers were being developed at 16/14nm and 10/7nm, it was assumed that developing a chip at 28nm would be less expensive, less complex, and that the process rule deck would shrink. That worked for decades. Th... » read more

New Trends In Wafer Bonding
By Katherine Derbyshire - 21 Nov, 2019 - Comments: 0

Unable to scale horizontally, due to a combination of lithography delays and power constraints, manufacturers are stacking devices vertically. This has become essential as the proliferation of mobile devices drives demand for smaller circuit footprints, but the transition isn't always straightforward. Three-dimensional integration schemes take many forms, depending on the required interconne... » read more

Speeding Up 3D Design
By Brian Bailey - 14 Nov, 2019 - Comments: 0

2.5D and 3D designs have garnered a lot of attention recently, but when should these solutions be considered and what are the dangers associated with them? Each new packaging option trades off one set of constraints and problems for a different set, and in some cases the gains may not be worth it. For other applications, they have no choice. The tooling in place today makes it possible to de... » read more

Addressing Pain Points In Chip Design
By Ed Sperling - 13 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

Which Verification Engine When
By Ed Sperling - 31 Oct, 2019 - Comments: 0

Frank Schirrmeister, group director for product marketing at Cadence, talks about which tools get used throughout the design flow, from architecture to simulation, formal verification, emulation, prototyping all the way to production, how the cloud has impacted the direction of the flow, and how machine learning will impact verification. » read more

Migrating 3D Into The Mainstream
By Brian Bailey - 31 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for ANSYS' Semiconductor Business Unit; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Business;... » read more

IP Management And Development At 5/3nm
By Ann Mutschler - 24 Oct, 2019 - Comments: 1

The growing complexity of moving to new process nodes is making it much more difficult to create, manage and re-use IP. There are more rules, more data to manage, and more potential interactions as density increases, both in planar implementations and in advanced packaging. And the problems only get worse as designs move to 5nm and 3nm, and as more heterogeneous components such as accelerato... » read more

Making Random Variation Less Random
By Ed Sperling - 21 Oct, 2019 - Comments: 0

The economics for random variation are changing, particularly at advanced nodes and in complex packaging schemes. Random variation always will exist in semiconductor manufacturing processes, but much of what is called random has a traceable root cause. The reason it is classified as random is that it is expensive to track down all of the various quirks in a complex manufacturing process or i... » read more

Scaling Up And Down
By Nerissa Draeger - 21 Oct, 2019 - Comments: 1

You don’t have to look very far in the semiconductor world before you see the word “scaling.” Perhaps you read an industry news article headline about transistor scaling – how those nearly nanoscale components are shrinking even smaller in size down to the atomic scale. Or maybe you heard a reference to memory capacity scaling – how our favorite mobile devices can store more high-reso... » read more

Who’s Watching The Supply Chain?
By Ed Sperling - 17 Oct, 2019 - Comments: 0

Every company developing chips at the most advanced process nodes these days is using different architectures and heterogeneous processing and memory elements. There simply is no other way to get the kind of power/performance improvements needed to justify the expense of moving to a new process node. So while they will reap the benefits of traditional scaling, that alone is no longer enough. ... » read more

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