tag: AI

Reducing Chip Test Costs With AI-Based Pattern Optimization
By Rahul Singhal - 31 Jul, 2023 - Comments: 0

The old adage “time is money” is highly applicable to the production testing of semiconductor devices. Every second that a wafer or chip is under test means that the next part cannot yet be tested. The slower the test throughput, the more automatic test equipment (ATE) is needed to meet production throughput demands. This is a huge issue for chip producers, since high pin counts, blazingly ... » read more

A Packet-Based Architecture For Edge AI Inference
By Pat Donnelly - 27 Jul, 2023 - Comments: 0

Despite significant improvements in throughput, edge AI accelerators (Neural Processing Units, or NPUs) are still often underutilized. Inefficient management of weights and activations leads to fewer available cores utilized for multiply-accumulate (MAC) operations. Edge AI applications frequently need to run on small, low-power devices, limiting the area and power allocated for memory and comp... » read more

DAC 2023: Megatrends And The Road Ahead For Design Automation
By Frank Schirrmeister - 27 Jul, 2023 - Comments: 0

As Silicon Valley is in the midst of the heat wave the world is experiencing, the recent Design Automation Conference and its exhibition discussed hot technologies. Three megatrends defined the current situation – artificial intelligence (AI), chiplets, and integration. To me, the more exciting aspect of DAC was the discussion of what is ahead for EDA in the decade to come, and for that, the ... » read more

Solving 5G And 6G Challenges With Artificial Intelligence
By Sarah LaSelva - 27 Jul, 2023 - Comments: 0

Wireless networks are inherently complex, generate massive amounts of data, and have grown in complexity with each new generation of technology. This combination of large data sets and complexity makes wireless networks an ideal candidate for AI. People are receiving first-hand experiences of the power and potential of deep neural networks and machine learning (ML) as the technology begins t... » read more

Using AI To Close Coverage Gaps
By Ed Sperling - 26 Jul, 2023 - Comments: 0

Verification of complex, heterogeneous chips is becoming much more difficult and time-consuming. There are more corner cases, and devices have to last longer and behave according to spec throughout their lifetimes. This is where AI fits in. It can help identify redundancy and provide information about why a particular device or block may not be able to be fully covered, and it can do it in less... » read more

Generative AI Training With HBM3 Memory
By Frank Ferro - 20 Jul, 2023 - Comments: 0

One of the biggest, most talked about application drivers of hardware requirements today is the rise of Large Language Models (LLMs) and the generative AI which they make possible.  The most well-known example of generative AI right now is, of course, ChatGPT. ChatGPT’s large language model for GPT-3 utilizes 175 billion parameters. Fourth generation GPT-4 will reportedly boost the number of... » read more

A Bridge From Mars To Venus
By Steve Roddy - 20 Jul, 2023 - Comments: 0

In a now-famous 1992 pop psychology book titled "Men Are from Mars, Women Are from Venus," author John Gray posited that most relationship troubles in couples stem from fundamental differences in socialization patterns between men and women. The analogy that the two partners came from different planets was used to describe how two people could perceive issues in completely different and sometim... » read more

Megatrends At DAC
By Ann Mutschler - 17 Jul, 2023 - Comments: 0

Spotting key trends over three days of a semiconductor design conference is a challenge, but some important ones come into focus after attending multiple sessions — AI/ML, chiplet integration, and heterogeneous integration in an SoC and package. Frank Schirrmeister, vice president solutions and business development at Arteris IP, talks about a variety of topics that fit under the DAC umbrella... » read more

A Design Architecture For Optically Broadband Programmable PICs Utilizing Micromechanical Resonances 
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “Synchronous micromechanically resonant programmable photonic circuits” was published by researchers at The MITRE Corporation, Massachusetts Institute of Technology, Sandia National Laboratories, University of Arizona, and Brookhaven National Laboratory. Abstract: "Programmable photonic integrated circuits (PICs) are emerging as powerful tools for the precise ... » read more

A Photonic Circuit Architecture Allowing Faster, More Efficient Transfer of Large Amounts of Data
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled "Massively scalable Kerr comb-driven silicon photonic link" was published by researchers at Columbia University and Air Force Research Laboratory. Abstract: "The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs and limi... » read more

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