IP Requires System Context At 6/5/3nm

By Ann Mutschler - 01 May, 2019 - Comments: 0

Driven by each successive generation of semiconductor manufacturing technology, complexity has reached dizzying levels. Every part of the design, verification and manufacturing is more complicated and intense the more transistors are able to be packed onto a die. For these reasons, the entire system must be taken into consideration as a whole – not just as individual building blocks as could ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 05 Apr, 2019 - Comments: 0

Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more

Heterogeneous Design Creating Havoc With Firmware Versions

By Ed Sperling - 01 Apr, 2019 - Comments: 0

Adding different kinds of processing elements into chips is creating system-level incompatibilities because of sometimes necessary, but usually uncoordinated, firmware updates from multiple vendors. In the past, firmware typically was synchronized with other firmware and the chip was verified and debugged. But this becomes much more difficult when multiple heterogeneous processing elements a... » read more

Of Aero Shows And Safety

By Janusz Kitel - 28 Mar, 2019 - Comments: 0

At the end of February, I attended the Aero Show in India - and what a show it was. So many exhibitors from around the world, including all main players from the commercial and military sides of the aerospace industry. Visitors could see everything required to build a modern aircraft: from small components like specialized ICs, cables and connectors up to big parts, such as the jet engines... » read more

Week In Review: Design, Low Power

By Jesse Allen - 01 Mar, 2019 - Comments: 0

Tools & IP OneSpin Solutions debuted the Hardware Metric Calculation (HMC) App, which uses automatically extracted design information to calculate key hardware metrics to comply with functional safety standards. In particular, it focuses on automotive and autonomous driving SoCs needing to meet the highest functional safety requirements defined by the ISO 26262 standard. The HMC App calcul... » read more

DO-254 Requirements Traceability

By Aldec - 27 Feb, 2019 - Comments: 0

DO-254 enforces a strict requirements-driven process for the development of commercial airborne electronic hardware. For DO-254, requirements must drive the design and verification activities, and requirements traceability helps to ensure this. This paper explains the rationale behind requirements traceability including its purpose and resulting benefits when done correctly. Click here to re... » read more

Clock Domain Crossings in the FPGA World

By Aldec - 30 Jan, 2019 - Comments: 0

Clock domain crossing (CDC) issues cause significant amount of failures in ASIC and FPGA devices. As FPGA complexity and performance grows, the influence of CDC issues on design functionality grows even more. This paper outlines CDC issues and their solutions for FPGA designs. Various design techniques are presented together with real-life examples for Xilinx and Intel FPGA devices. More import... » read more

Week In Review: Design, Low Power

By Jesse Allen - 25 Jan, 2019 - Comments: 0

M&A Ansys will acquire Helic, a provider of electromagnetic crosstalk analysis and signoff tools. Founded in 2000, Helic's tools included pre- and post-LVS EM modeling, inductor synthesis and modeling, and analysis of crosstalk risk. The company's technology will be integrated into a solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis. Th... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Jan, 2019 - Comments: 0

M&A Rambus acquired the assets of Diablo Technologies. Founded in 2003, Diablo Technologies specialized in NVDIMM technologies, but was hit with a patent lawsuit by Netlist in 2013. While Diablo won the lawsuit and several subsequent appeals, it declared bankruptcy in December 2017. Rambus says the technology will provide a foundation for integrating existing DRAM and Flash along with emer... » read more

Deep Learning Hardware: FPGA vs. GPU

By Farhad Fallahlalehzari - 20 Dec, 2018 - Comments: 0

FPGAs or GPUs, that is the question. Since the popularity of using machine learning algorithms to extract and process the information from raw data, it has been a race between FPGA and GPU vendors to offer a HW platform that runs computationally intensive machine learning algorithms fast and efficiently. As Deep Learning has driven most of the advanced machine learning applications, it is r... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Aldec

IP Requires System Context At 6/5/3nm

Week In Review: Design, Low Power

Heterogeneous Design Creating Havoc With Firmware Versions

Of Aero Shows And Safety

Week In Review: Design, Low Power

DO-254 Requirements Traceability

Clock Domain Crossings in the FPGA World

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Deep Learning Hardware: FPGA vs. GPU