tag: ANSYS

Week In Review: Design, Low Power
By Jesse Allen - 15 Jul, 2022 - Comments: 0

Tools & IP Cadence will acquire Future Facilities, a provider of electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins. Future Facilities’ product portfolio includes an electronics thermal solution, as well as computational fluid dynamics (CFD) electronics cooling simulation technology that op... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 15 Jul, 2022 - Comments: 0

Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

Customization, Heterogenous Integration, And Brute Force Verification
By Ed Sperling - 14 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

Blog Review: July 13
By Jesse Allen - 13 Jul, 2022 - Comments: 0

Siemens' John Sturtevant finds that the patterning requirements of next generation lithographic processes have pushed lithographers to explore the advantages of curvilinear masks, and notes some of the tools coming along to help. Cadence's Paul McLellan learns from Kyle Chen of Microsoft and Suomin Cui of Cadence how deep learning and electromagnetic solvers can be used to optimize high-dens... » read more

Electromagnetic Simulation And 3D-IC Interposers
By Matt Commens - 11 Jul, 2022 - Comments: 0

By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Jul, 2022 - Comments: 0

Tools, IP, design Infineon Technologies acquired NoBug, a provider of design verification services. The acquisition will help Infineon expand its IoT R&D business in eastern Europe. “This considerable increase in superior verification know-how lets Infineon offer its customers more of its leading products at a reduced time-to-market,” said Guenter Krasser, Vice President and Managing D... » read more

Which Fuel Will Drive Next-Generation Autos?
By Ann Mutschler - 07 Jul, 2022 - Comments: 0

With gasoline prices hitting uncomfortable highs, consumers increasingly are looking toward non-gasoline-powered vehicles. But what ultimately will power those vehicles is far from clear. Inside the cabin and under the hood, these vehicles will be filled with semiconductors. Yet what the energy source is for those semiconductors is the subject of ongoing debate. It could be batteries, hydrog... » read more

What Formula 1 Racing Says About Auto’s High-Tech Future
By Marie C. Baca - 07 Jul, 2022 - Comments: 0

To learn about the future of the auto industry, you can interview analysts and experts, peruse scientific publications, and attend various conferences. Or you can watch multi-million dollar race cars hurtle around a track at speeds of upwards of 220 miles per hour. Welcome to Formula 1, the international auto racing sport with a cumulative TV audience of 1.55 billion people. The budgets are ... » read more

Blog Review: July 6
By Jesse Allen - 06 Jul, 2022 - Comments: 0

Synopsys' Mike Gianfagna looks at how the data center paradigm has shifted in the last ten years with an exponential increase in the amount of data demanding new approaches to storage that rely on distributed networks. Cadence's Frank Schirrmeister explains multidisciplinary design analysis and optimization, or MDAO, and how it is being combined with machine learning models to enhance classi... » read more

Week In Review, Manufacturing, Test
By Karen Heyman - 01 Jul, 2022 - Comments: 0

Samsung announced initial production of its 3nm process node, which uses a gate-all-around (nanosheet) transistor structure that the company calls Multi-Bridge-Channel FET (MBCFET). The first-generation 3nm process can reduce power consumption by up to 45% compared with a 5nm process, as well as improve performance by 23% and reduce area by 16%, according to the company. The second-generation 3... » read more

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