Blog Review: Feb. 2


Synopsys' Stelios Diamantidis shares some predictions for AI in 2022, including the three markets that will push new AI chips, the increasing need for trust chains, the entry of non-traditional companies, and the impact of AI in chip design. Siemens EDA's Ray Salemi checks out how Python and SystemVerilog can work together to boost the verification ecosystem by taking advantage of what each ... » read more

Week In Review: Design, Low Power


Kalray, a provider of programmable data processing and storage acceleration cards for data centers, will acquire Arcapix Holdings, which provides software-defined storage and data management solutions for data-intensive applications. "I am delighted at the prospect of this acquisition that will accelerate our go-to-market and strengthen our key position in the data-intensive storage market. It ... » read more

Week In Review: Auto, Security, Pervasive Computing


China’s regulators are agreeing to AMD’s acquisition of Xilinx with the caveat that AMD must agree not to force tie-in sales Xilinx's products with AMD products, according to Reuters. China's State Administration for Market Regulation said the companies cannot discriminate against customers using other technology. Xilinx's SEC 8-K form confirms that the two companies received clearance for ... » read more

Blog Review: Jan. 26


Arm's Mark Inskip shares how the Morello prototype architecture, aimed at improving the security of hardware, was developed, from the creation of the prototype architecture specification, followed by the design and implementation of a new CPU, through to the development of a new SoC, hardware platform, development tools, toolchains, and software. Cadence's Paul McLellan looks at how the RISC... » read more

Blog Review: Jan. 19


Synopsys' Anand Thiruvengadam examines the memory chip design challenges of optimizing PPA, speeding turnaround time, and improving reliability and how a shift-left approach can help. Cadence's Paul McLellan checks out some of TSMC's recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between IR-drop and TSV usage in multi-chip physical verific... » read more

SuperGrid Institute Responds to Energy and Climate Demands


Researchers and developers at SuperGrid Institute use Ansys electronics software solutions to perform studies on power converters, critical links in the chain between electric generators and consumers, for their clients. Fig. 1: Medium-voltage DC grid power supply topology. As an independent research and innovation institute based in France, SuperGrid Institute is dedicated to developin... » read more

High-Tech: Innovation At The Speed of Light


As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip. Winning demands a new design paradigm that ... » read more

Setting Ground Rules For 3D-IC Designs


Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Blog Review: Jan. 12


Synopsys' Twan Korthorst introduces the history of photonics, why it is important for the semiconductor industry, key market applications, and the future of photonic integrated circuits. Cadence's Paul McLellan takes a look at TSMC's recent announcements around its N3 and N3 HPC notes and the push for performance gains through design technology co-optimization Siemens' Sebastian Flock che... » read more

The Gargantuan 5G Chip Challenge


Blazing fast upload and download speeds for cellular data are coming, but making the technology function as expected throughout its expected lifetime is an enormous challenge that will require substantial changes across the entire chip ecosystem. While sub-6GHz is an evolutionary step from 4G LTE, the real promise of 5G kicks in with millimeter-wave (mmWave) technology. But these higher-freq... » read more

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