tag: ANSYS

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2022 - Comments: 0

Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Week In Review, Design, Low Power
By Marie C. Baca - 29 Jul, 2022 - Comments: 0

Financial News Cadence announced second quarter revenue of $858 million, an increase of 17.9% compared with the same period a year ago when revenue was $728 million. President and CEO Anirudh Devgan said the company’s results are “emblematic of the megatrends of the long-term strength of semis, systems companies investing more in silicon, and the convergence of system and chip designs.�... » read more

Bespoke Silicon Redefines Custom ASICs
By Ann Mutschler - 28 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss bespoke silicon and what's driving that customization with Kam Kittrell, vice president of product management in the Digital & Signoff group at Cadence; Rupert Baines, chief marketing officer at Codasip; Kevin McDermott, vice president of marketing at Imperas; Mo Faisal, CEO of Movellus; Ankur Gupta, vice president and general manager of Siemens... » read more

Blog Review: July 27
By Jesse Allen - 27 Jul, 2022 - Comments: 0

Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

Near-Threshold Computing Gets A Boost
By Brian Bailey - 25 Jul, 2022 - Comments: 0

Near-threshold computing has long been used for power-sensitive devices, but some surprising, unrelated advances are making it much easier to deploy. While near-threshold logic has been an essential technique for applications with the lowest power consumption, it always has been difficult to use. That is changing, and while it is unlikely to become a mainstream technique, it is certainly bec... » read more

Week in Review: Design, Low Power
By Marie C. Baca - 22 Jul, 2022 - Comments: 0

Acquisitions Renesas completed its acquisition of Reality Analytics, which specializes in embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial and commercial products. Siemens Digital Industries Software will acquire Zona Technology, which develops aerospace simulation software. Siemens plans to integrate that software into its wXcelerator and Simcenter... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 22 Jul, 2022 - Comments: 0

Security Flex Logix Technologies is partnering with Intrinsic ID to secure and protect any device using its eFPGA, so the device can’t be modified maliciously, through physical attacks or remote hacking. Flex Logix’s EFLX ePFGA will have Intrinsic ID’s SRAM physical unclonable function (PUF), a military-grade security IP that gives a device a unique silicon ID. The ID secures confidentia... » read more

Blog Review: July 20
By Jesse Allen - 20 Jul, 2022 - Comments: 0

Synopsys' Ron Lowman examines the various neural networks used in camera applications, the balancing act between camera lens choice and neural networks implemented, and how IP and embedded vision processors help optimize the designs. Siemens' Katie Tormala considers the importance of acoustic performance in consumer electronics and why it's important to understand the relationships between t... » read more

Using AI To Speed Up Edge Computing
By John Koon - 19 Jul, 2022 - Comments: 0

AI is being designed into a growing number of chips and systems at the edge, where it is being used to speed up the processing of massive amounts of data, and to reduce power by partitioning and prioritization. That, in turn, allows systems to act upon that data more rapidly. Processing data at the edge rather than in the cloud provides a number of well-documented benefits. Because the physi... » read more

Data Management Evolves
By Ann Mutschler - 19 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss data management challenges with Jerome Toublanc, business development executive at Ansys; Kam Kittrell, vice president of product management in the Digital & Signoff Group at Cadence; Simon Rance, vice president of marketing at Cliosoft; Rob Conant, vice president of software and ecosystem at Infineon Technologies; and Michael Munsey, senior dir... » read more

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