tag: Applied Materials

Blog Review: April 10
By Jesse Allen - 10 Apr, 2019 - Comments: 0

Arm's Paul Whatmough discusses the growing use of real-time computer vision on mobile devices and proposes transfer learning as a way to enable neural network workloads on resource-constrained hardware. Cadence's Anton Klotz highlights a collaboration with Imec and TU Eindhoven on cell-aware test that reduces defect simulation time by filtering out defects with equivalent fault effects. M... » read more

3D NAND Metrology Challenges Growing
By Mark LaPedus - 09 Apr, 2019 - Comments: 8

3D NAND vendors face several challenges to scale their devices to the next level, but one manufacturing technology stands out as much more difficult at each turn—metrology. Metrology, the art of measuring and characterizing structures, is used to pinpoint problems and ensure yields for all chip types. In the case of 3D NAND, the metrology tools are becoming more expensive at each iteration... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Apr, 2019 - Comments: 0

Public policy The rise of the digital economy is creating millions of new jobs, but it’s difficult to fill these positions. So, the Consumer Technology Association (CTA), a U.S.-based trade group, is encouraging hi-tech companies to offer more apprenticeships. This is especially true for software engineering, networking, data analytics, cybersecurity and artificial intelligence. The Semic... » read more

Single Vs. Multi-Patterning EUV
By Mark LaPedus - 25 Mar, 2019 - Comments: 5

Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

Selective Removal For Stronger Fins
By Matt Cogorno - 21 Mar, 2019 - Comments: 0

By Matt Cogorno and Toshihiko Miyashita Remember when we could charge our mobile phones on a Sunday and not even think about it again until the next weekend? There was a time when battery life wasn’t even in the top ten concerns when purchasing a mobile phone. Today however, smartphones are constantly being used for computing, gaming, video streaming and other power-hungry applications, so... » read more

EUV Mask Readiness Challenges
By Mark LaPedus - 21 Mar, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and photomask technologies with Emily Gallagher, principal member of the technical staff at Imec; Harry Levinson, principal at HJL Lithography; Chris Spence, vice president of advanced technology development at ASML; Banqiu Wu, senior director of process development at Applied Materials; and Aki Fujimura, chief ... » read more

Generation 10+ Fabs Enable Bigger, Brighter, Better TV Displays
By Applied Materials - 21 Mar, 2019 - Comments: 0

Consumers are moving to larger and larger televisions, attracted by the chance to have a more immersive experience and the ability to see what is on the screen from farther away. TV sizes continue to grow by 1 to 1.5 inches per year, and sales of TVs with 65” or larger screens—so-called Gen10+ flat panel displays (FPDs)—are growing exponentially (figure 1). Figure 1. Television shi... » read more

E-Beam Review And CD Measurement Revolutionizes Display Yield Management
By Applied Materials - 20 Mar, 2019 - Comments: 0

Fundamental changes are occurring in the display industry, driven by demands for higher-resolution screens and other capabilities for both mobile and TV applications. To meet these demands, the display technology roadmap in this article calls for innovations in materials, processes and device technology. Critical requirements include smaller design rules and the adoption of a range of materi... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Mar, 2019 - Comments: 0

Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

Blog Review: Mar. 13
By Jesse Allen - 13 Mar, 2019 - Comments: 0

Mentor's Tom Fitzpatrick questions whether deep learning approaches can really help improve coverage in modern, complex designs. Cadence's Paul McLellan listens in at MWC as Huawei chairman Guo Ping defends the company's security practices and shows where its heading in 5G. Synopsys' Eric Huang checks out the newly announced USB4 specification, changes to previous USB names, and a few things ... » read more

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