tag: Applied Materials

President Obama Visits Applied Materials
By Applied Materials Writers - 16 May, 2013 - Comments: 0

By John Kania [caption id="attachment_8398" align="alignnone" width="518" caption="Applied Materials CEO Mike Splinter with President Barack Obama as they tour the Austin manufacturing clean room and hear from Applied employee Nilam D. Bhakta-Sahib about the complex chip making process. "][/caption] President Obama rode Air Force One into Austin, Texas, to shine a spotlight on the import... » read more

Design-For-DSA Industry Begins To Assemble
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus The industry is aggressively pursuing directed self-assembly (DSA) as an alternative patterning technology for future chip designs. DSA, which enables fine pitches through the use of block copolymers, is in the R&D pilot line stage today. The fab tools, process flows and materials are basically ready, but there are still several challenges to bring the technology from th... » read more

Foundry Models In Transition
By Jeff Chappell - 18 Apr, 2013 - Comments: 0

By Jeff Chappell There may have been a time when AMD founder Jerry Sanders famous quote: "real men (i.e., real companies) have their own fabs” rang true, but in today's business climate it seems quaint at best. Fabless or fab-lite business models are more popular than ever today, while some IDMs have turned back the clock, so to speak, looking to improve capacity utilization and revenues ... » read more

Waiting For 3D Metrology
By Mark LaPedus - 18 Apr, 2013 - Comments: 0

By Mark LaPedus Over the years, suppliers of metrology equipment have managed to meet the requirements for conventional planar chips. But tool vendors now find themselves behind in the emerging 3D chip era, prompting the urgent need for a new class of 3D metrology gear. 3D is a catch-all phrase that includes a range of new architectures, such as finFET transistors, 3D NAND and stacked-die ... » read more

Wanted: New Metrology Funding Models
By Mark LaPedus - 21 Mar, 2013 - Comments: 0

By Mark LaPedus The shift toward the 20nm node and beyond will require new and major breakthroughs in chip manufacturing. Most of the attention centers around lithography, gate stacks, interconnects, strain engineering and design-for-manufacturing (DFM). Lost in the conversation are two other critical but overlooked pieces in the manufacturing puzzle—wafer inspection and metrology. ... » read more

Directed Self-Assembly Grows Up
By Mark LaPedus - 21 Mar, 2013 - Comments: 1

By Mark LaPedus At last year’s SPIE Advanced Lithography conference, Christopher Bencher, a member of the technical staff at Applied Materials, said the buzz surrounding directed self-assembly (DSA) technology resembled the fervor generated at the famous Woodstock rock concert in 1969. This was clearly evident from the tumultuous and free-flowing movement that threatened the status quo o... » read more

Swimming In Data
By Ed Sperling - 21 Mar, 2013 - Comments: 0

By Ed Sperling So many warnings about data overload have been issued over the past decade that people generally have stopped paying attention to them. The numbers are so astronomical that increases tend to lose meaning. Nowhere is this more evident than in the semiconductor metrology world, where files are measured in gigabytes. And at each new process node, as the number of transistors a... » read more

Nanoscale Wiring
By Kathryn Ta - 21 Mar, 2013 - Comments: 0

By Kathryn Ta The TEM image (below) taken at Applied Materials’ Maydan Technology Center shows a series of 20nm-wide trenches in cross section. These tiny structures – about 1/5000th of the diameter of an average human hair – are similar to the interconnects used to wire the billions of transistors in next-generation microchips. You can see that each trench is partially filled with coppe... » read more

Getting Ready For High-Mobility FinFETs
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus The IC industry entered the finFET era in 2011, when Intel leapfrogged the competition and rolled out the newfangled transistor technology at the 22nm node. Intel hopes to ramp up its second-generation finFET devices at 14nm by year’s end, with plans to debut its 11nm technology by 2015. Hoping to close the gap with Intel, silicon foundries are accelerating their efforts t... » read more

Foundry Arms Race Under Way
By Mark LaPedus - 21 Feb, 2013 - Comments: 0

By Mark LaPedus A year ago, chipmakers were reeling from a severe shortage of 28nm foundry capacity, prompting foundries to ramp up their fabs at a staggering pace. At the time, foundries were unable to keep up with huge and unforeseen demand for mobile chips. The shortfall was also caused by low yields and the overall lack of installed 28nm capacity. Today, the 28nm crunch is largely ov... » read more

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