tag: Applied Materials

The Week In Review: Sept. 27
By Ed Sperling - 27 Sep, 2013 - Comments: 0

By Ed Sperling Applied Materials shook up the equipment market, announcing a deal to buy Tokyo Electron for about $9.3 billion in stock. The combination of No. 2 Applied and No. 3 TEL in that market equals a new No. 1, surpassing Dutch giant ASML in terms of revenue. Mentor Graphics rolled out a new versiion of its computational fluid dynamics product, adding Monte Carlo radiation modeling... » read more

Applied To Buy TEL
By Mark LaPedus - 24 Sep, 2013 - Comments: 0

In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. Under the terms of the blockbuster deal, Applied Materials will own approximately 68% of the new company and TEL will own about 32%.  The combined entities will have a new name, dual headquarter... » read more

The Week In Review: Sept. 23
By Mark LaPedus - 23 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, Apple’s iPhones have incorporated a separate RF switch and diversity switch from Peregrine Semiconductor (PSMI). The switches are based on a silicon-on-insulator (SOI) variant called silicon-on-sapphire (SOS). Murata takes Peregrine’s RF switches and integrates them into a module. Doug Freedman, an analyst with RBC Capital, said Apple is no longer using PSMI�... » read more

Litho Roadmap Remains Cloudy
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus For some time, the lithography roadmap has been cloudy. Optical lithography has extended much further than expected. And delays with the various next-generation lithography (NGL) technologies have forced the industry to re-write the roadmap on multiple occasions. Today, there is more uncertainty than ever in lithography. Until recently, for example, leading-edge logic chipma... » read more

What’s After 3D NAND?
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus Planar NAND flash memory is on its last scaling legs, with 3D NAND set to become the successor to the ubiquitous 2D technology. Samsung Electronics, for one, already has begun shipping the industry’s first 3D NAND device, a 24-level, 128-gigabit chip. In addition, Micron and SK Hynix shortly will ship their respective 3D NAND devices. But the Toshiba-SanDisk duo are the lo... » read more

Front End Comes To The Back End
By Jeff Chappell - 19 Sep, 2013 - Comments: 0

By Jeff Chappell For outsourced assembly and test (OSAT) houses either planning for or already offering through-silicon via (TSV) capability for their 3D packaging efforts, this has meant the front end is coming to the back end, in a manner of speaking. A bit of an exaggeration perhaps, as most generalizations are. But thanks to TSVs, in a very real sense some of what would typically be the... » read more

The Week In Review: Sept. 16
By Mark LaPedus - 16 Sep, 2013 - Comments: 0

By Mark LaPedus In June, Crucial.com teamed up with Lou Ferrigno to invite all frustrated computer users to submit a short video showing their most fearsome, frustration-filled and computer-induced roar. Each video was evaluated according to a variety of factors, including volume, enthusiasm, perceived distress, frustration, anxiety, irritation and overall hopelessness. The memory module suppl... » read more

Blog Review: Sept. 11
By Ed Sperling - 11 Sep, 2013 - Comments: 0

By Ed Sperling Synopsys’ Eric Huang has unearthed the weirdest USB video ever produced—a dancing USB lighter. The messaging is pretty bizarre, too. Cadence’s Brian Fuller takes a whirlwind tour of the engineering accomplishments for the week. Check out the T-shirt message. Clearly they’re not talking about semiconductor engineers. Mentor’s Colin Walls looks at the Lua scripting... » read more

Materials Innovation Key To Enabling Next-Generation Mobile Devices
By Kathryn Ta - 09 Sep, 2013 - Comments: 0

By Kathryn Ta There’s a lot of excitement building regarding several new mobile product announcements on the horizon, including a concept smartwatch, a new phablet and a new smartphone. These products are sure to be on a lot of consumers’ wish lists this holiday season, and users will expect them to have a sleeker look and feel, while running applications instantly, providing all-day batte... » read more

The Week In Review: Sept. 9
By Mark LaPedus - 09 Sep, 2013 - Comments: 0

By Mark LaPedus SK Hynix’ DRAM fab in China caught on fire. The fire caused one minor injury, but it did not impact the equipment, according to reports. SK Hynix will re-open the fab soon, according to reports. Bob Halliday, Applied Materials’ CFO, gave a presentation at an analyst event, saying: “I think there’s probably more technology inflections going on right now than in years.... » read more

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