Chip Industry Week In Review

By The SE Staff - 10 May, 2024 - Comments: 0

Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys' recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys' president and CEO, said in... » read more

New Ways To Optimize GEMM-Based Applications Targeting Two Leading AI-Optimized FPGA Architectures

By Technical Paper Link - 07 May, 2024 - Comments: 0

A technical paper titled “Efficient Approaches for GEMM Acceleration on Leading AI-Optimized FPGAs” was published by researchers at The University of Texas at Austin and Arizona State University. Abstract: "FPGAs are a promising platform for accelerating Deep Learning (DL) applications, due to their high performance, low power consumption, and reconfigurability. Recently, the leading FPGA... » read more

Chip Industry Technical Paper Roundup: May 7

By Liz Allan - 07 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=223 /] More ReadingTechnical Paper Library home » read more

Metrology For 2D Materials: A Review From The International Roadmap For Devices And Systems (NIST, Et Al.)

By Technical Paper Link - 30 Apr, 2024 - Comments: 0

A technical paper titled “Metrology for 2D materials: a perspective review from the international roadmap for devices and systems” was published by researchers at Arizona State University, IBM Research, Unity-SC, and the National Institute of Standards and Technology (NIST). Abstract: "The International Roadmap for Devices and Systems (IRDS) predicts the integration of 2D materials into h... » read more

Chip Industry Week In Review

By The SE Staff - 22 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys acquired Intrinsic ID, which develops physical unclonable func... » read more

Chip Industry Week In Review

By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Chip Industry Week In Review

By The SE Staff - 19 Jan, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Money Pours Into New Fabs And Facilities

By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Technical Paper Roundup: November 28

By Linda Christensen - 28 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=169 /] More Reading Technical Paper Library home » read more

Lateral 3 kV AlN SBDs on Bulk AlN Substrates By MOCVD

By Technical Paper Link - 27 Nov, 2023 - Comments: 0

A new technical paper titled "3 kV AlN Schottky Barrier Diodes on Bulk AlN Substrates by MOCVD" was published by researchers at Arizona State University. Abstract "This letter reports the first demonstration of AlN Schottky diodes on bulk AlN substrates by metalorganic chemical vapor phase deposition (MOCVD) with breakdown voltages exceeding 3 kV. The devices exhibited good rectifying char... » read more

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tag: Arizona State University

Chip Industry Week In Review

New Ways To Optimize GEMM-Based Applications Targeting Two Leading AI-Optimized FPGA Architectures

Chip Industry Technical Paper Roundup: May 7

Metrology For 2D Materials: A Review From The International Roadmap For Devices And Systems (NIST, Et Al.)

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Money Pours Into New Fabs And Facilities

Technical Paper Roundup: November 28

Lateral 3 kV AlN SBDs on Bulk AlN Substrates By MOCVD

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