tag: ARM

CEO Outlook: Chip Industry 2022
By Ed Sperling - 02 May, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss broad industry changes and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a live audience... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Apr, 2022 - Comments: 0

Arm unveiled the Arm Cortex-M85 processor and expanded Arm Virtual Hardware to more platforms, including 3rd party devices. The Cortex-M85 is the highest performance Cortex-M processor to date, with 30% scalar performance uplift compared to the Cortex-M7, technology to support endpoint ML and DSP workloads, and includes Pointer Authentication and Branch Target Identification (PACBTI), a new arc... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 29 Apr, 2022 - Comments: 0

Automotive, mobility DENSO Corporation and UMC’s Japanese subsidiary United Semiconductor Japan Co., Ltd. (USJC) are collaborating on power semiconductors production for the automotive market at USJC’s 300mm fab. USJC will install an insulated gate bipolar transistor (IGBT) line at its wafer fab. Renesas Electronics uncorked an integrated automotive ECU Virtualization Platform for devel... » read more

The Challenges Of Incremental Verification
By Brian Bailey - 28 Apr, 2022 - Comments: 1

Verification consumes more time and resources than design, and yet little headway is being made to optimize it. The reasons are complex, and there are more questions than there are answers. For example, what is the minimum verification required to gain confidence in a design change? How can you minimize the cost of finding out that the change was bad, or that it had unintended consequences? ... » read more

Big Changes In Embedded Software
By Ann Mutschler - 28 Apr, 2022 - Comments: 0

Every good hardware or software design starts with a structured approach throughout the design cycle, but as chip architectures and applications begin focusing on specific domains and include some version of AI, that structure is becoming more difficult to define. Embedded software, which in the past was written for very narrow functions with a minimal footprint, is increasingly getting blended... » read more

Arm’s Input Qualification Methodology Using PowerPro
By Siemens EDA - 27 Apr, 2022 - Comments: 0

This white paper proposes a new automated input qualification methodology that Arm developed using Siemens EDA’s PowerPro software portfolio that performs various data integrity checks at the IC design build and prototype stage. This methodology ensures in quicker iterations that input data are high fidelity, leading to a well correlated power numbers. Should multiple iterations be necessary,... » read more

Blog Review: April 27
By Jesse Allen - 27 Apr, 2022 - Comments: 0

Siemens' Joseph Dailey and Jake Wiltgen dispel misunderstandings around safety qualification of software tools and point to some of the safety issues that could lead to schedule delays and additional costs. Synopsys' Mark Kahan explains the testing that went into creating parts of the James Webb Space Telescope and key questions that were asked to ensure the mission could be successful even ... » read more

Paving The Way To Chiplets
By Mark LaPedus - 25 Apr, 2022 - Comments: 2

The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

More Options, Less Dark Silicon
By Ed Sperling - 20 Apr, 2022 - Comments: 0

Chipmakers are beginning to re-examine how much dark silicon should be used in a heterogenous system, where it works best, and what alternatives are available — a direct result of a slowdown in Moore's Law scaling and the increasing disaggregation of SoCs. The concept of dark silicon has been around for a couple decades, but it really began taking off with the introduction of the Internet ... » read more

Blog Review: April 20
By Jesse Allen - 20 Apr, 2022 - Comments: 0

Cadence's Paul McLellan looks at the difference between 3D packaging and 3D integration and the different approaches to system-in-package designs. Siemens' Spencer Acain finds that despite having less precision and flexibility than digital chips, analog computing is having a resurgence in the space of cutting-edge AI thanks to the speed and energy efficiency in specialized tasks. Synopsys... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy