tag: ArterisIP

Predictions: Methodologies And Tools
By Brian Bailey - 25 Jan, 2018 - Comments: 0

Predictions are divided into four posts this year. Part one covered markets and drivers. The second part looked at manufacturing, devices and companies and this part will cover methodologies and tools. In addition, the outlook from EDA executives will be provided in a separate post. Intellectual property As designs get larger, it should be no surprise that the size of the [getkc id="43" kc_... » read more

Predictions: Manufacturing, Devices And Companies
By Brian Bailey - 18 Jan, 2018 - Comments: 0

Some predictions are just wishful thinking, but most of these are a lot more thoughtful. They project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the end of the year. (See Reflection On 2017: Design And EDA and Man... » read more

The Week In Review: Design
By Jesse Allen - 12 Jan, 2018 - Comments: 0

M&A Synopsys acquired one-time programmable non-volatile memory IP provider Kilopass. Founded in 2001, Kilopass' 1T and 2T bitcell IP supports up to 4-Mbit OTP instances in 180-nm to 7-nm process technologies. The acquisition will add to Synopsys' growing OTP NVM portfolio: last October, Synopsys acquired Sidense, another provider of the technology. Terms of the deal were not disclosed. ... » read more

Predictions: Markets And Drivers
By Brian Bailey - 11 Jan, 2018 - Comments: 0

Semiconductor Engineering received a record number of predictions this year. Some of them are just wishful thinking, but many are a lot more thoughtful and project what needs to happen for various markets or products to become successful. Those far reaching predictions may not fully happen within 2018, but we give everyone the chance to note the progress made towards their predictions at the en... » read more

Getting Serious About Chiplets
By Ann Mutschler - 08 Jan, 2018 - Comments: 0

Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

Reflections On 2017: Manufacturing And Markets
By Brian Bailey - 28 Dec, 2017 - Comments: 0

People love to make predictions, and most of the time they have it easy, but at Semiconductor Engineering, we ask them to look back on the predictions they make each year and to assess how close to the mark they were. To see what they missed and what surprised them. Not everyone accepts our offer to grade themselves, but many have this year. This is the first of two parts that looks at the pred... » read more

Building In Functional Safety At The Lowest Hardware Levels Supports Autonomous Driving’s Future
By Kurt Shuler - 27 Dec, 2017 - Comments: 0

Long before automotive electronic system designers chose artificial intelligence and machine learning as the path toward the future of autonomous driving’s future, it was clear that high-performance computing platforms typically found in data center systems clearly were not going to provide all the answers. Automotive system designers place more emphasis on functional safety and resilience, w... » read more

Mixing Interface Protocols
By Ann Mutschler - 21 Dec, 2017 - Comments: 0

Continuous and pervasive connectivity requires devices to support multiple interface protocols, but that is creating problems at multiple levels because each protocol is based on a different set of assumptions. This is becoming significantly harder as systems become more heterogeneous and as more functions are crammed into those devices. There are more protocols that need to be supported to ... » read more

The Trouble With Models
By Ed Sperling - 20 Dec, 2017 - Comments: 0

Models are becoming more difficult to develop, integrate and utilize effectively at 10/7nm and beyond as design complexity, process variation and physical effects add to the number of variables that need to be taken into account. Modeling is a way of abstracting the complexity in various parts of the semiconductor design, and there can be dozens of models required for complex SoCs. Some are ... » read more

EDA Challenges Machine Learning
By Brian Bailey - 14 Dec, 2017 - Comments: 1

Over the past few years, [getkc id="305" kc_name="machine learning"] (ML) has evolved from an interesting new approach that allows computers to beat champions at chess and Go, into one that is touted as a panacea for almost everything. While there is clearly a lot of hype surrounding this, it appears that machine learning can produce a better outcome for many tasks in the EDA flow than even the... » read more

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