tag: Bruker

What Data Center Chipmakers Can Learn From Automotive
By Anne Meixner - 11 Apr, 2023 - Comments: 2

Automotive OEMs are demanding their semiconductor suppliers achieve a nearly unmeasurable target of 10 defective parts per billion (DPPB). Whether this is realistic remains to be seen, but systems companies are looking to emulate that level of quality for their data center SoCs. Building to that quality level is more expensive up front, although ultimately it can save costs versus having to ... » read more

New Spintronics Manufacturing Process, Allowing Scaling Down To Sub-5nm (U. of Minnesota/NIST)
By Technical Paper Link - 20 Mar, 2023 - Comments: 0

A new technical paper titled "Sputtered L10-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics" was published by researchers at University of Minnesota and NIST, with funding by DARPA and others. According to a University of Minnesota summary news article, "The industry standard spintronic material, cobalt iron boron, has reached a limit in its scalability. The... » read more

Metrology Strategies For 2nm Processes
By Laura Peters - 07 Mar, 2023 - Comments: 3

Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are taking on the increasingly 3D nature of structures and the new materials they incorporate. For instance, processes like hybrid bonding, 3D NAND flash devices, and nanosheet FETs are pushing the bo... » read more

Standards: The Next Step For Silicon Photonics
By Karen Heyman - 07 Mar, 2023 - Comments: 0

Testing silicon photonics is becoming more critical and more complicated as the technology is used in new applications ranging from medicine to cryptography, lidar, and quantum computing, but how to do that in a way that is both consistent and predictable is still unresolved. For the past three decades, photonics largely has been an enabler for high-speed communications, a lucrative market t... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Mechanical Characterization Of Ultra Low-k Dielectric Films
By Bruker - 08 Feb, 2023 - Comments: 0

Dielectric materials are of critical importance in the function of microelectronic devices because they electrically isolate conductive components from one another in microcircuits. Capacitance between conductors can limit a circuit’s maximum operating frequency, and the capacitance increases in inverse proportion to the separation distance between the conductors. Therefore, to minimize the s... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 03 Feb, 2023 - Comments: 0

Imec released its semiconductor roadmap, which calls for doubling compute power every six months to handle the data explosion and new data-intensive problems. Imec named five walls (scaling, memory, power, sustainability, cost) that need to be dismantled. The roadmap (below) stretches from 7nm to 0.2nm (2 angstroms) by 2036, and includes four generations of gate-all-around FETs followed by thre... » read more

Metrology Options Increase As Device Needs Shift
By Laura Peters - 10 Jan, 2023 - Comments: 1

Semiconductor fabs are taking an ‘all hands on deck’ approach to solving tough metrology and yield management challenges, combining tools, processes, and other technologies as the chip industry transitions to nanosheet transistors on the front end and heterogenous integration on the back end. Optical and e-beam tools are being extended, while X-ray inspection is being added on a case-by-... » read more

IR Laser Imaging Is Rapidly Changing IR Microscopy
By Bruker - 10 Jan, 2023 - Comments: 0

IR laser imaging is finally being commercialized into smart analytical equipment. New applications continue to emerge and yield massive advantages, thanks to the direct combination with FT-IR technology. The application notes below provide valuable insights into three applications of IR laser imaging: Tissue imaging Surface analysis Forensic science Click here to read more. » read more

Systematic Yield Issues Now Top Priority At Advanced Nodes
By Laura Peters - 06 Dec, 2022 - Comments: 0

Systematic yield issues are supplanting random defects as the dominant concern in semiconductor manufacturing at the most advanced process nodes, requiring more time, effort, and cost to achieve sufficient yield. Yield is the ultimate hush hush topic in semiconductor manufacturing, but it's also the most critical because it determines how many chips can be profitably sold. "At older nodes, b... » read more

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