Challenges Mount In New Autos

By John Koon - 06 Sep, 2022 - Comments: 0

Electronics are becoming the primary differentiator for carmakers, adding an array of options that can alter everything from how a vehicle's occupants interact with their surroundings to how the vehicle drives. But the infrastructure needed to support these features also raises a slew of technology and business questions for which there are no simple answers today. For example, how will new ... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 02 Sep, 2022 - Comments: 0

Trade regulations/legal The U.S. government placed new restrictions on sales of GPUs to China that could be used for high-performance computing, artificial intelligence, and other advanced applications. NVIDIA said in an SEC filing Wednesday that officials told the company it must seek an export license for sales to China or Russia of its A100 and H100 chips, and any system that includes those... » read more

Driver Monitoring Raises Complexity, Adds Privacy Concerns

By Marie C. Baca - 01 Sep, 2022 - Comments: 0

While you watch the road, your car may be watching you back. The automotive industry’s transition toward self-driving technology means cars increasingly are equipped with features that measure driver alertness and engagement, among many other data points. Executives say such features save lives and spur innovation, while simultaneously raising significant technical, legal, and ethical questio... » read more

Structured Grids Are Here For An Eternity

By Veena Parthan - 01 Sep, 2022 - Comments: 0

With unstructured meshes delivering promising results in resolving boundary layers, wakes, and other flow features for complex geometries, one might arrive at the conclusion that structured grids will soon be out of the markets because of their reputation for taking a long time for generation. On the contrary, structured grids give you two things that unstructured meshes may lack, i.e., quality... » read more

Design For Security Now Essential For Chips, Systems

By Ann Mutschler - 01 Sep, 2022 - Comments: 0

It's nearly impossible to create a completely secure chip or system, but much can be done to raise the level of confidence about that security. In the past, security was something of an afterthought, disconnected from the architecture and added late in the design cycle. But as chips are used increasingly in safety- and mission-critical systems, and as the value of data continues to rise, the... » read more

In-Design Thermal Analysis For MMIC And RF PCB Power Applications

By Cadence - 31 Aug, 2022 - Comments: 0

Next-generation wireless communication and radar systems often demand increased RF power within a smaller footprint to meet the performance and size requirements of their respective commercial and aerospace applications. As a result, RF front-end electronics are exposed to the risk of higher operating temperatures, which degrade RF performance and threaten device reliability. For many device ma... » read more

L5 Adoption Hinges on 5G/6G

By Marie C. Baca - 31 Aug, 2022 - Comments: 1

Truly self-driving cars don’t yet exist, and research shows many consumers are wary of them anyway. What will it take to make fully autonomous cars possible? And how can automakers convince consumers to adopt such vehicles? Experts say the answer to both questions could lie in wireless communication networks. That’s because such networks offer a workaround to a major obstacle in autonomo... » read more

Blog Review: Aug. 31

By Jesse Allen - 31 Aug, 2022 - Comments: 0

Cadence's Paul McLellan wonders what's happened to 450mm wafers as equipment development efforts end, the only wafer fab is decommissioned, and manufacturers see little likelihood to recoup further investment in R&D. Synopsys' Manuel Mota finds that the scale and modular flexibility of chiplets can help meet narrowing time-to-market windows and looks at how UCIe provides a complete stack... » read more

Week In Review: Manufacturing, Test

By Karen Heyman - 26 Aug, 2022 - Comments: 0

Regional Shifts Supply chains are moving away from China. Apple, Honda, and Mazda are in line to diversify their manufacturing across different regions, according to one report. Another report says Apple plans to manufacture some of its new iPhone 14s in India. Mexico wants to be part of U.S.’s drive to move chip manufacturing closer to home, hosting American financiers to discuss elect... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 26 Aug, 2022 - Comments: 0

Quantum computing Baidu introduced a 10-qubit quantum computer called Qianshi and what it described as “the world's first all-platform quantum hardware-software integration solution that provides access to various quantum chips via mobile app, PC, and cloud.” The company said it has also completed the design of a 36-qubit quantum chip. Scientists said “levitating” nanoparticles co... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

tag: Cadence

Challenges Mount In New Autos

Week In Review: Design, Low Power

Driver Monitoring Raises Complexity, Adds Privacy Concerns

Structured Grids Are Here For An Eternity

Design For Security Now Essential For Chips, Systems

In-Design Thermal Analysis For MMIC And RF PCB Power Applications

L5 Adoption Hinges on 5G/6G

Blog Review: Aug. 31

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power