tag: Cadence

Bespoke Silicon Rattles Chip Design Ecosystem
By Ann Mutschler - 19 Oct, 2022 - Comments: 0

Bespoke silicon developers are shaking up relationships, priorities, and methodologies across the semiconductor industry, creating demand for skills that cross traditional boundaries, and driving new business models that leverage these enormous investments. Bespoke silicon designers today are a rare breed, capable of understanding the unique requirements of a specific domain, as well as a gr... » read more

Blog Review: Oct. 19
By Jesse Allen - 19 Oct, 2022 - Comments: 0

Siemens EDA's Harry Foster examines trends related to various aspects of FPGA design and the growing design complexity associated with increasing number of embedded processor cores, asynchronous clock domains, and more safety features. Synopsys' Twan Korthorst and Kenneth Larsen take a broad look at silicon photonics, including the benefits of electronic integration, accelerating the develop... » read more

Complex Tradeoffs In Inferencing Chips
By John Koon - 17 Oct, 2022 - Comments: 0

Designing AI/ML inferencing chips is emerging as a huge challenge due to the variety of applications and the highly specific power and performance needs for each of them. Put simply, one size does not fit all, and not all applications can afford a custom design. For example, in retail store tracking, it's acceptable to have a 5% or 10% margin of error for customers passing by a certain aisle... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Oct, 2022 - Comments: 0

Cadence unveiled a new environment to automate and accelerate the complete design closure cycle from signoff optimization through routing, static timing analysis (STA), and extraction. The Certus Closure Solution allows concurrent, full-chip optimization through a massively parallel and distributed architecture and engine shared with Cadence’s Innovus Implementation System and the Tempus Timi... » read more

Heterogeneous Integration Co-Design Won’t Be Easy
By Tom Beckley - 13 Oct, 2022 - Comments: 0

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless interaction between your analog and digital IC and package design teams. Heterogeneous integration is the use of advanced packaging technologies to combine smaller, discrete chiplets into one syste... » read more

Beyond Autonomous Cars
By Marie C. Baca - 12 Oct, 2022 - Comments: 0

As the automotive industry takes a more measured approach to self-driving cars and long-haul trucks for safety and security reasons, there is a renewed focus on other types of vehicles utilizing autonomous technology. The list is long and growing. It now includes autonomous trains, helicopters, tractors, ships, submarines, drones, delivery robots, motorcycles, scooters, and bikes, all of whi... » read more

Blog Review: Oct. 12
By Jesse Allen - 12 Oct, 2022 - Comments: 0

Synopsys' Richard Solomon, Madhumita Sanyal, and Gary Ruggles take a look at the possibilities that CXL 3.0 can bring to a variety of data-driven applications that demand increasingly higher levels of memory capacity, with higher bandwidth, more security, and lower latency. Siemens EDA's Rich Edelman provides some tips for debugging UVM testbenches, such as how to determine what line changed... » read more

Week in Review: Design, Low Power
By Marie C. Baca - 07 Oct, 2022 - Comments: 0

Could power beams be the key to smart city infrastructure and 5G/6G connectivity? A new report says both lasers and microwaves offer possible paths forward in this area, though both technologies come with benefits and drawbacks. Diminishing returns from process scaling, coupled with pervasive connectedness and an exponential increase in data, are driving broad changes in how chips are desi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 Oct, 2022 - Comments: 0

Automotive, mobility Infineon opened a new factory in Cegléd, Hungary, for assembly and test of high-power semiconductor modules for EVs. “The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications,” said Infineon’s COO Rutger Wijburg in a press release. Production ramp-up started in February 2022. Infineon also announced it will ... » read more

EVs Raise Energy, Power, And Thermal IC Design Challenges
By Ann Mutschler - 06 Oct, 2022 - Comments: 0

The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

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