Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 26 Aug, 2022 - Comments: 0

Automotive, mobility California will ban the sale of new gasoline vehicles so that by 2035 100% of new cars and light trucks sold in California will be zero-emission vehicles. NXP Semiconductors announced multi-year supply agreements for its S32 family. Agreements to supply the S32 domain and zonal automotive processors to OEMs will include upcoming 5nm ASIL-D processors. Keysight Techno... » read more

The Next Incarnation Of EDA

By Brian Bailey - 25 Aug, 2022 - Comments: 0

The EDA industry has incrementally addressed issues as they arise in the design of electronic systems, but is there about to be a disruption? Academia is certainly seeing that as a possibility, but not all of them see it happening for the same reason. The academic community questioned the future of EDA at the recent Design Automation Conference. Rather than EDA as we know it going away, they... » read more

Chasing The Next Level Of Productivity

By Frank Schirrmeister - 25 Aug, 2022 - Comments: 0

The keynotes at the recent Design Automation Conference (DAC) gave some great insights into the direction of semiconductor technology and chip and system design. For the first time in a long time, my family members and friends have gained awareness of the importance of semiconductors and electronic design automation. I think this means it is also time to look back on where productivity improvem... » read more

How Climate Change Affects Data Centers

By Marie C. Baca - 25 Aug, 2022 - Comments: 0

Data centers are hot, and they may get even hotter. As climate change impacts temperatures around the world, designers are changing the computing hubs that are tied to nearly every aspect of modern life to make them more efficient, more customized, and potentially more disaggregated. These shifts are taking on new urgency as the tech industry grapples with months of sweltering temperatures o... » read more

Verification Scorecard: How Well Is The Industry Doing?

By Brian Bailey - 25 Aug, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss how well verification tools and methodologies have been keeping up with demand, with Larry Lapides, vice president of sales for Imperas Software; Mike Thompson, director of engineering for the verification task group at OpenHW; Paul Graykowski, technical marketing manager for Arteris IP; Shantanu Ganguly, vice president of product marketing at Caden... » read more

Is There A Limit To The Number of Layers In 3D-NAND?

By Karen Heyman - 24 Aug, 2022 - Comments: 1

Memory vendors are racing to add more layers to 3D NAND, a competitive market driven by the explosion in data and the need for higher-capacity solid state drives and faster access time. Micron already is filling orders for 232-layer NAND, and not to be outdone, SK Hynix announced that it will begin volume manufacturing 238-layer 512Gb triple level cell (TLC) 4D NAND in the first half of next... » read more

Machine Learning-Driven Full-Flow Chip Design Automation

By Cadence - 24 Aug, 2022 - Comments: 0

To enable the semiconductor industry to continue growing, the chip design process must become more efficient. With the availability of massive, cloud-enabled, distributed computing and advancements in machine learning computer science, the next chip design automation revolution is now possible. The Cadence® Cerebrus™ Intelligent Chip Explorer utilizes both of these technologies, based o... » read more

Blog Review: Aug. 24

By Jesse Allen - 24 Aug, 2022 - Comments: 0

Synopsys' Manuel Mota presents an overview of some of the newest multi-chip module packaging types and their advantages and disadvantages for different kinds of applications, as well as the importance of die-to-die interfaces. Cadence's Steve Brown finds that innovative products require that electronics be analyzed in the context of the environment in which they run, making mechanical and el... » read more

Week In Review: Design, Low Power

By Jesse Allen - 19 Aug, 2022 - Comments: 0

The U.S. Commerce Department's Bureau of Industry and Security (BIS) issued new export controls on EDA software aimed at designing gate-all-around FETs, which manufacturers plan to implement starting at 3nm (Samsung) and 2nm (Intel and TSMC). Specifically, the ruling controls export of software that is specially designed for implementing RTL to GDSII (or an equivalent standard) for GAA FET desi... » read more

Week in Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 19 Aug, 2022 - Comments: 0

Automotive and Mobility Lyft launched a new robotaxi service that operates on and around the Las Vegas Strip using the electric Ioniq 5 vehicle from Motional. Similar services by other companies are currently in use in a handful of other U.S. cities, including San Francisco and Phoenix. The new Lyft service currently requires the presence of safety drivers, though Lyft and Motional say it will... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?