Why Hardware-Dependent Software Is So Critical

By Brian Bailey - 23 Jun, 2022 - Comments: 0

Hardware and software are two sides of the same coin, but they often live in different worlds. In the past, hardware and software rarely were designed together, and many companies and products failed because the total solution was unable to deliver. The big question is whether the industry has learned anything since then. At the very least, there is widespread recognition that hardware-depen... » read more

Embedded World 2022: Structural Changes In Ecosystems

By Frank Schirrmeister - 23 Jun, 2022 - Comments: 0

As my train approaches Nuremberg for the Embedded World conference—which this year is in June versus its usual timing in February—I am reviewing my past related blogs back to 2012. My complaints about the cold weather have been a common thread in past blogs, but with a weather forecast of 28°C/80°F, I will probably ask for cooler weather at the end of the day. Past key themes included tec... » read more

EDA Embraces Big Data Amid Talent Crunch

By Marie C. Baca - 23 Jun, 2022 - Comments: 0

The semiconductor industry’s labor crunch finally has convinced chip designers to bet big money on big data. As recently as 2016, executives weren’t sure there was a market for big data approaches to electronic design automation. The following year, utilization of big data remained stuck in its infancy. And in 2018, Semiconductor Engineering questioned why the EDA sector wasn’t investi... » read more

Blog Review: June 22

By Jesse Allen - 22 Jun, 2022 - Comments: 0

Arm's Andrew Pickard checks out a project at Sorbonne Université in Paris that is using the Cortex-M3 processor source code to model what is happening in the hardware at the microarchitectural level and find ways to prevent side-channel leakage of sensitive cryptographic information. Cadence's Paul McLellan digs into the development of high-NA EUV lithography and some of the challenges ahea... » read more

Overcoming Signal, Power, And Thermal Challenges Implementing GDDR6 Interfaces

By Cadence - 22 Jun, 2022 - Comments: 0

Graphics processing units (GPUs) and graphics double data rate (GDDR) memory interfaces are essential to graphics cards, game consoles, high-performance computing (HPC), and machine learning applications. These interfaces enable data transfer speeds of over 665GB per second today and will continue to support well over a terabyte per second (TBps) in next-generation GDDR interfaces. Signal integ... » read more

Designing and Simulating Low-Voltage CMOS Circuits Using Four-Parameter Model

By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New technical paper titled "Bridging the Gap between Design and Simulation of Low-Voltage CMOS Circuits" from researchers at Federal University of Santa Catarina, Brazil. Abstract "This work proposes a truly compact MOSFET model that contains only four parameters to assist an integrated circuits (IC) designer in a design by hand. The four-parameter model (4PM) is based on the advanced com... » read more

Power Domain Implementation Challenges Escalate

By Ann Mutschler - 20 Jun, 2022 - Comments: 0

The number power domains is rising as chip architects build finer-grained control into chips and systems, adding significantly to the complexity of the overall design effort. Different power domains are an essential ingredient in partitioning of different functions. This approach allows different chips in a package, and different blocks in an SoC, to continue running with just enough power t... » read more

Week In Review: Design, Low Power

By Jesse Allen - 17 Jun, 2022 - Comments: 0

Tools, design, chips Altair, a provider of software and cloud services for CAE, HPC, simulation, and data analysis, acquired Concept Engineering, a provider of automatic schematic generation tools, electronic circuit and wire harness visualization platforms that provide on-the-fly visual rendering, and electronic design debug solutions. “Concept Engineering’s advanced, reactive visualizati... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Jun, 2022 - Comments: 0

Automotive, mobility U.S. National Highway Traffic Safety Administration (NHTSA) release its first crash reports from ADAS (advanced driver assistance systems, i.e., SAE Level 2) and ADS (automated driving systems, i.e., SAE Levels 3-5). The systems had to be in use at least 30 seconds before the crash in order for it to be reportable. The car may have had the system turned off at the time ... » read more

Blog Review: June 15

By Jesse Allen - 15 Jun, 2022 - Comments: 0

Ansys' Vidyu Challa considers common primary, or single-use, battery chemistries and how they affect that many important cell properties, such as energy density, flammability and safety, available cell constructions, temperature range, and shelf life. Synopsys' Rimpy Chugh and Rohit Kumar Ohlayan discuss some of the challenges arising from static linting of code, shifting linting left in the... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?