Week In Review: Design, Low Power

By Jesse Allen - 08 Mar, 2019 - Comments: 0

Cadence debuted Denali Gen2 IP for LPDDR5/4/4X in TSMC's 7nm FinFET process technology. The offering consists of PHY, controller and Verification IP. It supports both the pre-release LPDDR5 standard and LPDDR4/4X devices as well as Arm AMBA AXI buses and reliability features like in-line error correcting codes. The LPDDR5 standard provides up to 1.5x bandwidth over LPDDR4 and LPDDR4X. The US... » read more

How To Build An Automotive Chip

By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

Next Wave Of Security For IIoT

By Kevin Fogarty and Ed Sperling - 07 Mar, 2019 - Comments: 0

A rush of new products and services promise to make the famously un-secured Industrial IoT (IIoT) substantially more secure in the near future. Although the semiconductor industry has been churning out a variety of security-related products and concepts, ranging from root of trust approaches to crypto processors and physically unclonable functions, most IIoT operations have been slow to adop... » read more

Collaborative IC Design Mandates Integrated Data Management

By Cliosoft - 11 Feb, 2019 - Comments: 0

Over the last decade, design teams have encountered increased competition due to globalization (requiring the best available engineers irrespective of location), an exponential increase in design complexity, and shrinking market windows. This results in teams of engineers with different skill sets (for example analog, digital, MEMS, and RF), spread across multiple sites, managing complex flows,... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 08 Feb, 2019 - Comments: 0

Internet of Things McKinsey & Company identified 10 top trends in the Internet of Things. They include: IoT is a business opportunity, not just a tech opportunity; disciplined execution across multiple use cases is the path to value; and IoT is gradually enabling more subscription business models, but consumers are resistant. Louis Columbus of IQMS provides some IoT data points and id... » read more

EDA Grabs Bigger Slice Of Chip Market

By Brian Bailey - 31 Jan, 2019 - Comments: 0

EDA revenues have been a fairly constant percentage of semiconductor revenues, but that may change in 2019. With new customers creating demand, and some traditional customers shifting focus from advanced nodes, the various branches of the EDA tool industry may be where sticky technical problems are solved. IC manufacturing, packaging and development tools all are finding new ways to handle t... » read more

Chasing Reliability In Automotive Electronics

By Susan Rambo And Ed Sperling - 15 Jan, 2019 - Comments: 0

Assuring reliability in automotive electronics has set off a scramble across the semiconductor supply chain and unearthed a list of issues for which there is insufficient data, a lack of well-defined standards, and inconsistent levels of expertise. Reliable functional safety that spans 18 to 20 years of service in harsh environments, or under constant use with autonomous taxis or trucks, is ... » read more

IoT Merging Into Data-Driven Design

By Ed Sperling and Kevin Fogarty - 10 Jan, 2019 - Comments: 0

The Internet of Things is becoming more difficult to define and utilize for an effective business strategy. While an increasing number devices send data to the cloud or some local server, so much data is being generated and moved around that new strategies are being developed to rethink what needs to be processed where. Back in 2013, when the IoT concept really began taking off, connectivity... » read more

Mixed-Signal Methodology Guide

By Cliosoft - 09 Jan, 2019 - Comments: 0

ClioSoft wrote the chapter on SoC design data management in Cadence’s "Mixed-Signal Methodology Guide." Register to receive an electronic copy of this chapter. Introduction Software teams have long used version control and data management systems and they have become an integral part of a software development environment. Practically, no significant software project is started without a so... » read more

Making IP Friendlier

By Brian Bailey - 27 Dec, 2018 - Comments: 2

Semiconductor Engineering sat down to discuss IP tracking and management with Ranjit Adhikary, vice president of marketing for ClioSoft; Jim Bruister, director digital systems (since retired) at Silvaco; Marc Greenberg, product marketing group director at Cadence; and Kelvin Low, vice president of marketing at Arm. What follows are excerpts from that conversation. Part one can be found here. ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Cliosoft