tag: Coventor

3D NAND’s Vertical Scaling Race
By Mark LaPedus - 17 Dec, 2020 - Comments: 1

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, manufacturing, and cost challenges. Two suppliers, Micron and SK Hynix, recently leapfrogged the competition and have taken the scaling race lead in 3D NAND. But Samsung and the Kioxia-Western Digital (... » read more

Process Variation Analysis of Device Performance Using Virtual Fabrication
By Coventor - 16 Dec, 2020 - Comments: 0

A new methodology is demonstrated to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device performance. A model of a FinFET device was built using virtual device fabrication and testing. The model was subsequently calibrated on Design of Experiment corner case data that had been collected on a limited number of processed fab wafers. W... » read more

Accelerating Dry Etch Processes During Feature Dependent Etch
By Timothy Yang - 23 Nov, 2020 - Comments: 0

In dry etching, the trajectory of accelerated ions is non-uniform and non-vertical, due to collisions with gas molecules and other random thermal effects (figure 1). This has an impact on etch results, since the etch rate at any point on the wafer will vary depending on the solid angle visible to the bulk chamber and the ion flux for that angular range. These non-uniform and feature dependent e... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Nov, 2020 - Comments: 0

Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

A Study Of Wiggling AA Modeling And Its Impact On Device Performance In Advanced DRAM
By Coventor - 18 Nov, 2020 - Comments: 0

In this paper, a wiggling active area (fin) in an advanced 1x DRAM process was analyzed and modeled using the pattern-dependent etch simulation capabilities of the SEMulator3D semiconductor modeling software. Nonuniformity in sidewall passivation caused by hard mask pattern density loading was identified as the root cause of the wiggling profile. The calibrated model mimicked these phenomena, g... » read more

Micro Loading And Its Impact On Device Performance
By Qingpeng Wang - 02 Nov, 2020 - Comments: 0

In a DRAM structure, the charging and discharging process of capacitor-based memory cells is directly controlled by the transistor [1]. With transistor sizes approaching the lower limits of physical achievability, manufacturing variability and micro loading effects are becoming increasingly critical DRAM performance (and yield) limiters. The transistor’s AA (active area) dimension and profile... » read more

Virtual Fabrication At 7/5/3nm
By Ed Sperling - 23 Oct, 2020 - Comments: 0

David Fried, vice president of computational products at Lam Research, digs into virtual fabrication at the most advanced nodes, how to create models using immature processes at new nodes, and how to fuse together data from multiple different silos. » read more

Defect Challenges Grow For IC Packaging
By Mark LaPedus - 22 Oct, 2020 - Comments: 0

Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these technologies are necessary, they also are complementary. No one tool can meet all defect inspection requirements. As a result, packaging vendors may need to buy more and different tools. For years, p... » read more

Winning The Global Race For Semiconductor Technology With Virtual Fabrication
By David Fried - 22 Oct, 2020 - Comments: 0

Semiconductor process development is no easy task, with each generation of devices more difficult and expensive to create. Traditional cycles of build-and-test development are becoming obsolete, since they are too expensive and time-consuming for the most advanced processes. The high cost of process development Most chip designers developing new products rely on existing manufacturing process... » read more

Much Smarter Manufacturing
By Ed Sperling - 22 Oct, 2020 - Comments: 0

Smart manufacturing is undergoing some fundamental changes as more sensors are integrated across fabs to generate more usable data, and as AI/ML systems are deployed to sift through that data and identify patterns and anomalies more quickly. The concept of smart manufacturing — also referred to as Industrie 4.0 in Europe, for the fourth industrial revolution — emerged from the World Econ... » read more

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