tag: D2S

The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization 
By Technical Paper Link - 27 Feb, 2024 - Comments: 0

A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer co-optimization” was published by researchers at D2S and Micron. Abstract: "Full-chip curvilinear inverse lithography technology (ILT) requires mask writers to write full reticle curvilinear mask patte... » read more

Make The Impossible Possible: Use Variable-Shaped Beam Mask Writers And Curvilinear Full-Chip Inverse Lithography Technology For 193i Contacts/Vias With Mask-Wafer Co-Optimization
By eBeam Initiative - 22 Feb, 2024 - Comments: 0

Abstract: "Full-chip curvilinear inverse lithography technology (ILT) requires mask writers to write full reticle curvilinear mask patterns in a reasonable write time. We jointly study and present the benefits of a full-chip, curvilinear, stitchless ILT with mask-wafer co-optimization (MWCO) for variable-shaped beam (VSB) mask writers and validate its benefits on mask and wafer at Micron Tec... » read more

Blog Review: Feb. 7
By Jesse Allen - 07 Feb, 2024 - Comments: 0

Synopsys' Ian Land, Kenneth Larsen, and Rob Aitken find that a new approach will be required to ensure that higher volume 3D heterogeneous integration (3DHI) designs can function reliably and successfully in aerospace, defense, and government systems. Siemens' John Golding provides a primer on the fundamental concepts related to signal integrity, including key topics such as transmission lin... » read more

Top Tech Videos of 2023
By Liz Allan - 29 Dec, 2023 - Comments: 0

In 2023, heterogeneous integration, RISC-V, and advanced node logic scaling and advanced packaging dominated the semiconductor industry. All of those topics spurred deep discussions at conferences, and they were the subject of Semiconductor Engineering's most popular videos. Of the videos published in 2023, here are the highlights from our five channels: Manufacturing, Packaging & Mater... » read more

Industry Luminaries Highlight Opportunities For Advancing The Non-EUV Leading Edge
By Jan Willis - 19 Dec, 2023 - Comments: 0

The eBeam Initiative’s 12th annual Luminaries survey in 2023 reported a range of nodes from >5nm to 14nm as the most advanced non-EUV nodes using 193i lithography. A panel of semiconductor photomask and lithography experts debated several of the survey results, including this one, to provide more insights behind the results. Aki Fujimura, CEO of D2S, Inc., the managing company sponsor of t... » read more

Center For Deep Learning In Electronics Manufacturing: Bringing Deep Learning To Production For Photomask Manufacturing
By Jan Willis - 16 Nov, 2023 - Comments: 0

The Center for Deep Learning in Electronics Manufacturing (CDLe) was formed as an alliance between D2S, Mycronic and NuFlare Technology in autumn 2018. Assignees from each alliance partner worked with deep learning (DL) experts under the leadership of Ajay Baranwal, director of CDLe. The CDLe’s mission was to 1) turn DL into a core competency inside each of the companies and 2) do DL projects... » read more

Big Changes Ahead For Photomask Technology
By Gregory Haley - 19 Oct, 2023 - Comments: 0

The move to curvilinear shapes on photomasks is gaining steam after years of promise as a way of improving yield, lowering defectivity, and reducing wasted space on a die — all of which are essential for both continued scaling and improved reliability in semiconductors. Interest in this approach ran high at this year's SPIE Photomask Technology + EUV Lithography Conference. Put simply, cur... » read more

Why Curvy Design Now? Less Change Than You Think And Manufacturable Today
By Jan Willis - 19 Oct, 2023 - Comments: 0

A curvilinear (curvy) chip, if magically made possible, would be smaller, faster, and use less power. Magic is no longer needed on the manufacturing side, as companies like Micron Technology are making photomasks with curvy shapes using state-of-the-art multi-beam mask writers today. Yet the entire chip-design infrastructure is based on the Manhattan assumption of 90-degree turns, even though i... » read more

Survey: 2023 eBeam Initiative Luminaries Survey Results
By eBeam Initiative - 18 Oct, 2023 - Comments: 0

Luminaries are confident in high-NA EUV and curvilinear masks 12th Annual Luminaries Survey — July 2023 • Luminaries remain confident in broad High-NA EUV adoption by 2028 • Confidence doubled in leading-edge mask shops handling curvilinear mask demand • Curvilinear masks aren’t just for EUV • Luminaries are more confident about 2023 mask revenues than SEMI Click here to rea... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

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