tag: D2S

The Week In Review: Manufacturing
By Mark LaPedus - 27 Feb, 2015 - Comments: 0

At the SPIE Advanced Lithography conference in San Jose, Calif., there were several takeaways. First, the battle for lithography share is heating up at Intel. “We believe Nikon still holds a decent position at Intel, but with ASML gaining some share at 10nm. Nikon could regain some share with its new platform at 7nm, in our view, but it is early to tell. We believe Nikon has improved its posi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Feb, 2015 - Comments: 0

For years, chipmakers have attempted to build fabs in India. So far, however, India has failed to set up modern fabs and for good reason. There are issues in terms of obtaining dependable power and water for a fab in India, according to Will Strauss, president of Forward Concepts, who added that India also suffers from government bureaucracy. India is still trying. Last week, Cricket Semicon... » read more

5 Disruptive Mask Technologies
By Mark LaPedus - 19 Feb, 2015 - Comments: 0

Photomask complexity and costs are increasing at each node, thereby creating a number of challenges on several fronts. On one front, for example, traditional single-beam e-beam tools are struggling to keep up with mask complexity. As a result, the write times and costs continue to rise. Mask complexity also impacts the other parts of the tool flow, such as inspection, metrology and repair. I... » read more

How To Extend Litho Scaling
By Ann Mutschler - 19 Feb, 2015 - Comments: 0

IC mask [getkc id="80" comment="lithography"] today is sophisticated and complex. It's also a work in progress with a lot of unknowns as the industry struggles to increase productivity while reducing risk. The bulk of the work currently is focused on trying to figure out what would be a practical scheme for patterning lithography that could be used at 10nm and 7nm, said Gandharv Bhatara, Ca... » read more

Tech Talk: Photomask Challenges
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

GlobalFoundries' Bob Pack talks with Semiconductor Engineering about new problems experienced by photomask shops and how does lithography affects it all. [youtube vid=8hJwVhaZhFc] » read more

Fab Tool R&D And Ramen Noodles
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

The semiconductor equipment and materials industry has always been a tough business. Over the years, vendors have been under pressure to develop new technologies for a shrinking but demanding customer base. And as a result, many vendors could not keep up, or elected to exit the business, causing a massive shakeout in the industry. It isn’t getting any easier, though. Today, tool and... » read more

Tech Talk: Inverse Lithography
By Ed Sperling - 11 Dec, 2014 - Comments: 0

D2S’ Leo Pang talks with Semiconductor Engineering about lithography, inverse lithography, photomasks, where the problems are, and what needs to be done to move forward. [youtube vid=mn8JWaP8Z68] » read more

We Have Reached The Tipping Point For Simulation-Based Mask Data Preparation
By Aki Fujimura - 13 Nov, 2014 - Comments: 0

Since the beginning of the semiconductor industry, mask-data preparation (MDP) and mask verification (MV) have been shape-based: each shape has been treated as an entity unto itself, and if each isolated shape was correct, the mask was correct. This context independence is a critical assumption for conventional fracturing. However, as line/space measurements (L:S) fall below 50nm, shape-ba... » read more

Blog Review: Oct. 22
By Ed Sperling - 22 Oct, 2014 - Comments: 0

What is UX? The User Experience, of course. Rambus' Aharon Etengoff notes that the IoT UX is now the subject of a Harvard Business Review article. A long list of hurdles are expected at the 10nm process node, including multiple levels of local interconnects, more complex layout rules, timing problems, and a slew of others. Cadence's Richard Goering puts it all in perspective. Mentor's R... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Oct, 2014 - Comments: 0

It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

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