Data Leakage In Heterogeneous Systems

By Ed Sperling - 02 Nov, 2023 - Comments: 0

Semiconductor Engineering sat down with Paul Chou, senior director of security architecture at NVIDIA, to discuss data leakage in heterogeneous designs. What follows are excerpts of that one-on-one interview, which was held in front of a live audience at the Hardwear.io conference. SE: We think about hardware in terms of a chip, but increasingly there is data moving through different systems... » read more

Data, System Reliability, and Privacy

By Anne Meixner - 04 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss changes in test that address tracing device quality throughout a product’s lifetime, and over-arching concerns about data ownership and privacy, with Tom Katsioulas, CEO at Archon Design Solutions and U.S. Department of Commerce IoT advisory board member; Ming Zhang, vice president of R&D Acceleration at PDF Solutions; a... » read more

Training a ML model On An Intelligent Edge Device Using Less Than 256KB Memory

By Technical Paper Link - 11 Oct, 2022 - Comments: 0

A new technical paper titled "On-Device Training Under 256KB Memory" was published by researchers at MIT and MIT-IBM Watson AI Lab. “Our study enables IoT devices to not only perform inference but also continuously update the AI models to newly collected data, paving the way for lifelong on-device learning. The low resource utilization makes deep learning more accessible and can have a bro... » read more

Telecare Challenges: Secure, Reliable, Lower Power

By John Koon - 20 Jul, 2022 - Comments: 0

The adoption of telecare using a variety of connected digital devices is opening the door to much more rapid response to medical emergencies, as well as more consistent monitoring, but it also is adding new challenges involving connectivity, security, and power consumption. Telecare has been on the horizon for the better part of two decades, but it really began ramping with improvements in s... » read more

Hyperconnectivity’s Impact On Consumers

By Paul McLellan - 08 Jul, 2021 - Comments: 0

Do you know what hyperconnectivity is? It is already affecting you, whether you know it or not. Hyperscalers are the companies like AWS, Google, and Microsoft that build and run those enormous (aka hyperscale) data centers. If you are a designer and use the cloud, then you have at least a vague idea of what data centers are being used to handle your design. But even if you are the generic perso... » read more

CISO’s Guide To Sensitive Data Protection

By Synopsys - 31 Mar, 2021 - Comments: 0

Emerging data protection and privacy laws are causing organizations to scramble to implement strategies that address regulatory compliance and data security governance. And the SolarWinds software supply chain attack, in which attackers inserted a malicious back door into its network software release that later led to sensitive data exposure, further underscores the need to secure the DevSecOps... » read more

System Bits: Nov. 6

By Ann Mutschler - 06 Nov, 2018 - Comments: 0

Keeping data private To preserve privacy during data collection from the Internet, Stanford University researchers have developed a new technique that maintains personal privacy given that the many devices part of our daily lives collect information about how we use them. Stanford computer scientists Dan Boneh and Henry Corrigan-Gibbs created the Prio method for keeping collected data priva... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.