Hiding Security Keys Using ReRAM PUFs

By Katherine Derbyshire - 21 Apr, 2022 - Comments: 2

Resistive RAM and physically unclonable functions (PUFs) have been gaining traction for completely different reasons, but when combined they create an extremely secure and inexpensive way of storing authentication keys. As security concerns shift from purely software to a combination of hardware and software, chipmakers and systems companies have been scrambling to figure out how to prevent ... » read more

Nip The Defect In The Bud

By Melvin Lee - 12 Apr, 2022 - Comments: 0

As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address specific technology nodes optimizes a chip’s performance regarding that functionality, this performance comes at a cost: additional chips will need to be designed, developed, processed, and assembl... » read more

NIST Modifies & Improves Technique For Detecting Transistor Defects

By Technical Paper Link - 04 Apr, 2022 - Comments: 0

Abstract "We utilize a frequency-modulated charge pumping methodology to measure quickly and conveniently single “charge per cycle” in highly scaled Si/SiO2 metal–oxide–semiconductor field effect transistors. This is indicative of detection and manipulation of a single interface trap spin species located at the boundary between the SiO2 gate dielectric and Si substrate (almost certainl... » read more

HBM, Nanosheet FETs Drive X-ray Fab Use

By Laura Peters - 08 Mar, 2022 - Comments: 0

Paul Ryan, vice president and general manager of Bruker’s X-ray Business, sat down with Semiconductor Engineering to discuss the movement of x-ray metrology into manufacturing to better control nanosheet film stacks and solder bump quality. SE: Where are you seeing the greatest growth right now, and what are the critical drivers for your technology from the application side? Ryan: One b... » read more

Advanced High Throughput e-Beam Inspection With DirectScan

By PDF Solutions - 08 Mar, 2022 - Comments: 0

Optical inspection cannot resolve critical defects at advanced nodes and cannot detect subsurface defects. Especially at 7nm and below, many yield and reliability killer defects are the result of interactions between lithography, etch, and fill. These defects often will have part per billion (PPB) level fail rates. Conventional eBeam tools lack the throughput to measure PPB level fail rates. A ... » read more

Light-Emitting V-Pits: An Alternative Approach toward Luminescent Indium-Rich InGaN Quantum Dots

By Technical Paper Link - 21 Dec, 2021 - Comments: 0

Abstract: "Realization of fully solid-state white light emitting devices requires high efficiency blue, green, and red emitters. However, challenges remain in boosting the low quantum efficiency of long wavelength group-III-nitride light emitters through conventional quantum well growth. Here, we demonstrate a new direct metal–organic chemical vapor deposition approach to grow In-rich InGa... » read more

A quantitative model for the bipolar amplification effect: A new method to determine semiconductor/oxide interface state densities

By Technical Paper Link - 12 Oct, 2021 - Comments: 0

Abstract "We report on a model for the bipolar amplification effect (BAE), which enables defect density measurements utilizing BAE in metal–oxide–semiconductor field-effect transistors. BAE is an electrically detected magnetic resonance (EDMR) technique, which has recently been utilized for defect identification because of the improved EDMR sensitivity and selectivity to interface defects.... » read more

Fabs Drive Deeper Into Machine Learning

By Anne Meixner - 07 Sep, 2021 - Comments: 0

Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and speed. Each month a wafer fabrication factory produces tens of millions of wafer-level images from inspection, metrology, and test. Engineers must analyze that data to improve yield and to reject... » read more

The Importance Of Product Burn-In Test

By Vineet Pancholi - 22 Jul, 2021 - Comments: 0

Product burn-in (BI) is an indispensable step in the production test flow to ensure good quality and a properly functioning product for the customer. Amkor takes pride in rating ‘quality delivered to the customer’ as one of the highest corporate virtues. See figure 1. Fig. 1: Defects per Million (DPM) and DPM goal reported over five years. Burned-in integrated circuits (ICs) have a ... » read more

Where Imperfections Lead To Opportunity

By Evelyn Hu - 07 Jun, 2021 - Comments: 0

By Evelyn Hu It is natural to hold a bias that assumes that the highest-quality devices are those formed from the most perfect materials (crystalline, well-ordered, stoichiometric). Therefore, it is ironic, and perhaps counterintuitive, that particular kinds of defects, such as vacancies (missing atoms) in semiconductor materials, can form the building blocks of a new quantum information tec... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?